5
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as "antistatic (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION :
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
2.2.
How to Recycle the Lithium Ion Battery (U.S. Only)
Summary of Contents for HC-X900EB
Page 10: ...10 3 5 Formatting ...
Page 11: ...11 4 Specifications ...
Page 12: ...12 ...
Page 13: ...13 ...
Page 14: ...14 ...
Page 15: ...15 5 Location of Controls and Components ...
Page 16: ...16 ...
Page 17: ...17 ...
Page 30: ...30 8 3 5 Removal of the Top OP Unit Fig D6 Fig D7 ...
Page 33: ...33 Fig D13 8 3 11 Removal of the Flash P C B Fig D14 ...
Page 37: ...37 8 3 18 Removal of the Barrier Case Unit Fig D25 Fig D26 ...
Page 39: ...39 Fig D30 Fig D31 Fig D32 ...
Page 40: ...40 8 3 21 Removal of the EVF Lens Holder Unit Fig D33 Fig D34 ...
Page 44: ...44 8 3 29 Removal of the MOS Unit Fig D44 8 3 30 Removal of the Stepping Motor Fig D45 ...
