5
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as "antistatic (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION :
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
2.2.
How to Recycle the Lithium Ion Battery (U.S. Only)
Summary of Contents for HX-DC2PP
Page 9: ...9 3 5 Formatting...
Page 10: ...10 4 Specifications...
Page 11: ...11...
Page 12: ...12...
Page 18: ...18 7 3 1 Removal of the Side Case L Battery Cover and USB Cover Fig D1 Fig D2...
Page 19: ...19 Fig D3 Fig D4 7 3 2 Removal of the Battery Frame Fig D5...
Page 22: ...22 7 3 8 Removal of the Lens Unit Fig D11 7 3 9 Removal of the Main P C B Fig D12 Fig D13...
Page 24: ...24 Fig D17 7 3 13 Removal of the LCD Unit Fig D18 7 3 14 Removal of the LCD Hinge Unit Fig D19...
Page 26: ...26 Fig D24 7 3 17 Removal of the Mic Fig D25...
Page 34: ...Model No HX DC2 Schematic Diagram Note...
Page 35: ...Model No HX DC2 Parts List Note...
Page 36: ...Model No HX DC2 Main CAA Schematic Diagram Main P C B...
Page 37: ...Model No HX DC2 Main DMA Schematic Diagram Main P C B...
Page 38: ...Model No HX DC2 Main PWA Schematic Diagram Main P C B...
Page 39: ...Model No HX DC2 Flash Schematic Diagram Flash P C B...
Page 40: ...Model No HX DC2 Monitor Schematic Diagram Monitor P C B...
Page 41: ...Model No HX DC2 Main P C B Component Side...
Page 42: ...Model No HX DC2 Main P C B Foil Side...
Page 43: ...Model No HX DC2 Flash P C B Component Side...
Page 44: ...Model No HX DC2 Flash P C B Foil Side...
Page 45: ...Model No HX DC2 Monitor P C B Component Side...
Page 46: ...Model No HX DC2 Monitor P C B Foil Side...
Page 53: ...Model No HX DC2 Frame and Casing Section 1...
Page 54: ...Model No HX DC2 Frame and Casing Section 2...
Page 55: ...Model No HX DC2 Packing Parts and Accessories Section...
