5
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as “antistatic (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION :
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
2.2.
How to Recycle the Lithium Ion Battery (U.S. Only)
Summary of Contents for HX-WA03PP
Page 9: ...9 3 5 Formatting ...
Page 11: ...11 4 Specifications ...
Page 12: ...12 ...
Page 13: ...13 ...
Page 14: ...14 ...
Page 15: ...15 ...
Page 16: ...16 ...
Page 17: ...17 ...
Page 21: ...21 6 Troubleshooting Guide 6 1 Confirmation Flow of Waterproof ...
Page 22: ...22 6 2 Airtight Inspection with Air Leak Tester ...
Page 23: ...23 6 3 Air Leak Tester RFKZ0528 Operating Instruction ...
Page 24: ...24 ...
Page 25: ...25 ...
Page 26: ...26 ...
Page 27: ...27 7 Service Fixture Tools ...
Page 30: ...30 8 3 1 Removal of the Top Ornament Fig D1 8 3 2 Removal of the Front Cabinet Unit Fig D2 ...
Page 31: ...31 8 3 3 Removal of the Side L Cabinet Unit Fig D3 Fig D4 ...
Page 32: ...32 Fig D5 Fig D6 8 3 4 Removal of the Battery Cover Fig D7 ...
Page 33: ...33 Fig D8 8 3 5 Removal of the Waterproof Rubber Fig D9 Fig D10 ...
Page 36: ...36 Fig D16 8 3 10 Removal of the Lens Holder Fig D17 8 3 11 Removal of the Speaker Fig D18 ...
Page 37: ...37 8 3 12 Removal of the LCD Unit with Case Fig D19 Fig D20 ...
Page 38: ...38 Fig D21 Fig D22 ...
Page 39: ...39 Fig D23 8 3 13 Removal of the Hinge Cover LCD Case T Unit Fig D24 Fig D25 ...
Page 40: ...40 Fig D26 Fig D27 8 3 14 Removal of the LCD O Ring Fig D28 ...
Page 41: ...41 Fig D29 8 3 15 Removal of the LCD Panel Fig D30 ...
Page 42: ...42 Fig D31 8 3 16 Removal of the Built in Micro phones Monitor P C B Fig D32 ...
Page 43: ...43 Fig D33 Fig D34 ...
Page 44: ...44 8 3 17 Removal of the LCD Hinge Unit Fig D35 Fig D36 ...
Page 45: ...45 Fig D37 8 3 18 Removal of the Switch Unit Fig D38 ...
Page 46: ...46 Fig D39 Fig D40 ...
Page 49: ...49 10 Maintenance 10 1 Regular Maintenance Flow ...
