3. PREVENTION OF ELECTROSTATIC DISCHARGE
(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)
DEVICES
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such
components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical
ES devices are integrated circuits and somefield-effect transistors are semiconductor "chip"
components. The following techniques should be used to help reduce the incidence of
component damage caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any ESD on your
body touching a known earth ground. Alternatively, obtain and
weara commercially available discharging ESD wrist strap, which
should be removed for potential shock reasons prior to applying
power to the unit under test.
2. After removing an electrical assembly equipped with ES devices,
place the assembly on a conductive surface such as aluminum
foil, to prevent electrostatic charge buildup or exposure of the
assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an antistatic solder removal device. Some solder
removal devices not classified as "antistatic (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically
shorted together byconductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the
6
Summary of Contents for OmniVision PV-C2780-K
Page 8: ...Fig 1 3 Fig 1 4 8 ...
Page 26: ...Fig D5 6 1 2 1 Notes in chart 26 ...
Page 29: ...6 2 2 Inner Parts Location Fig J1 1 29 ...
Page 30: ...6 2 3 EJECT Position Confirmation Fig J1 2 30 ...
Page 31: ...6 2 4 Grounding Plate Unit Full Erase Head and Cylinder Unit Fig J2 1 31 ...
Page 44: ...6 3 CASSETTE UP ASS Y SECTION 6 3 1 Top Plate Wiper Arm Unit and Holder Unit Fig K1 1 44 ...
Page 81: ...81 ...
Page 85: ...11 2 MECHANISM BOTTOM SECTION 85 ...
Page 86: ...11 3 CASSETTE UP COMPARTMENT SECTION 86 ...
Page 87: ...11 4 CHASSIS FRAME SECTION 1 87 ...
Page 88: ...11 5 CHASSIS FRAME SECTION 2 88 ...
Page 89: ...11 6 PACKING PARTS AND ACCESSORIES SECTION 89 ...
