Operation manual for Narrow pitch connectors P5K
Panasonic Corporation
industrial.panasonic.com/ac/e/
©
Panasonic Corporation 2017
ACCTF29E-1
201708
- 8 -
(2) Flexible PC board specifications
Control the thicknesses of the coverlay and adhesive to prevent poor
soldering.
There is a clearance of approx. 0.05 mm between the bottom surface of the
terminal and the mold casing. Therefore, minimize the coverlay thickness,
otherwise poor soldering may be result.
If poor soldering occurs frequently, check the actual thickness of each insulation
layer.
Generally, the coverlay thickness is set to about 30 μm, including the
adhesive. If the thickness exceeds 30 μm, r
emove the coverlay under the
connector from the design.
(3) This connector can be used for main board-to- FPC connection.
In case that the flexible board is too short, excessive load affects the connector
and may be shifted out.
Please design as the flexible board is appropriately slack.
Connector
terminal
Mold casting of the connector
Coverlay (polyimide)
Adhesive (Epoxy adhesive recommended)
Adhesive (Epoxy adhesive recommended)
Copper foil
Base material (polyimide)
Support plate + Adhesive
(Epoxy adhesive recommended)
fixation
Connector
Wrong
:
too short
Positional gap
Motherboard
Part where
FPC board is fixed
Wrong
:
too long
Summary of Contents for P5K
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