PAN1782 Bluetooth Module
4 Specification
Product Specification Rev. 1.0
Page 24 of 42
4.7 Antenna Placement Recommendation
Antenna “Keep out Area”
Do not place any ground plane under the marked restricted antenna area in
any layer! This would be affecting the performance of the chip antenna in a
critical manner.
Impact of Placement on the Antenna Radiation Pattern
The placement of the module, surrounding material, and customer
components has an impact on the radiation pattern of the antenna.
The recommendation for the ground plane is based on a FR4 4-Layer PCB.
The following requirements must be met:
✓
The supply voltage must be free of AC ripple voltage (for example from a battery or a low
noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example
a ferrite in series connection and a bypass capacitor to ground of at least 47
µF directly at
the module).
✓
This module should not be mechanically stressed when installed.
✓
Keep this module away from heat. Heat is the major cause of decreasing the life time of
these modules.
✓
Avoid assembly and use of the target equipment in conditions where the module
temperature may exceed the maximum tolerance.
✓
Keep this module away from other high frequency circuits.
✓
Refer to the recommended pattern when designing a board.
The antenna requir
es a cutout area of 5 mm × 3 mm under the PAN1782 module. This “Keep
out Area” shall be located in every layer under the module antenna.
It is recommended to verify the perfect position of the module in the target application before
fixing the design.
