The Infrared Remote Control Unit replacement part is available as a complete
assembly unit only.
Do not try to disassemble the Infrared Remote Control Unit.
However, the battery cover is available separately as a replacement part.
3.3.15. Replacement Procedure for Leadless (Chip) Components
The following procedures are recommended for the replacement of the leadless
components used in this unit.
1. Preparation for replacement
A. Soldering Iron
Use a pencil-type soldering iron that uses less than 30 watts.
B. Solder
Eutectic Solder (Tin 63%, Lead 37%) is recommended.
C. Soldering time
Do not apply heat for more than 4 seconds.
D. Preheating
Leadless capacitor must be preheated before installation. -(266°F to 302°F)
(130°C To 150°C) for about two minutes.
Note:
1. Leadless components must not be reused after removal.
2. Excessive mechanical stress and rubbing of the component electrode must be
avoided.
2. Removing the leadless component
Grasp the leadless component body with tweezers and alternately apply heat to
both electrodes. When the solder on both electrodes is melted, remove the
leadless component with a twisting motion.
Note:
1. Do not attempt to lift the component off the board until the component is
completely disconnected from the board by a twisting action.
2. Be careful not to break the copper foil on the printed circuit board.
36
Summary of Contents for PV-4601 A
Page 14: ...Fig 2 3 14 ...
Page 27: ...Fig 11 1 1 27 ...
Page 40: ...Fig D1 40 ...
Page 42: ...Fig D2 42 ...
Page 43: ...Fig D3 43 ...
Page 44: ...Fig D4 44 ...
Page 45: ...Fig D5 45 ...
Page 46: ...Fig D7 46 ...
Page 47: ...Fig D8 47 ...
Page 51: ...Fig M2 1 Fig M2 2 51 ...
Page 53: ...Fig M4 1 53 ...
Page 77: ...Fig M19 77 ...
Page 84: ...Fig J5 84 ...
Page 85: ...Fig J6 85 ...
Page 87: ...Fig J9 87 ...
Page 88: ...Fig J10 88 ...
Page 89: ...Fig J11 89 ...
Page 90: ...Fig J12 90 ...
Page 91: ...Fig J13 91 ...
Page 92: ...Fig J15 92 ...
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Page 96: ...96 ...
Page 102: ...with the holes on the Pinch Lift Cam as shown in Fig A6 102 ...
Page 103: ...103 ...
Page 105: ...Fig K1 105 ...
Page 106: ...Fig K2 106 ...
Page 107: ...Fig K3 107 ...
Page 109: ...Fig B1 109 ...
Page 114: ...Fig E1 4 3 2 HOW TO READ THE ADJUSTMENT PROCEDURES 114 ...
Page 115: ...Fig E2 115 ...
Page 134: ...R6004 ERJ6GEYJ333V MGF CHIP 1 10W 33K 134 ...
Page 136: ...R6085 ERJ6GEYJ223V MGF CHIP 1 10W 22K 136 ...
Page 140: ...C4601 ECEA1CKA100 ELECTROLYTIC 16V 10 140 ...
Page 147: ...R6065 ERJ6GEYJ223V MGF CHIP 1 10W 22K 147 ...
Page 167: ...9 11 Operation Block Diagrams 1 167 ...
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