4
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive
(ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semi-
conductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused
by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as “antistatic (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
Summary of Contents for SDR-S50P
Page 11: ...11 4 Specifications...
Page 13: ...13...
Page 14: ...14...
Page 18: ...18 7 Service Fixture Tools 7 1 Service Tools and Equipment...
Page 21: ...21 Fig D3 Fig D4...
Page 24: ...24 Fig D13 Fig D14 Fig D15 Fig D16...
Page 25: ...25 Fig D17 Fig D18 Fig D19 Fig D20...
Page 26: ...26 Fig D21 Fig D22...
Page 28: ...28 8 4 1 How to use of CCD positioning pin RFKZ0476...
Page 30: ...30 9 2 2 Checking and repairing individual circuit boards How to use extension cables...
Page 31: ...31 9 3 Location for Connectors of the Main P C B 9 3 1 Main P C B...
Page 48: ...S 13...
Page 50: ...S 15 2 4 SDR T55 T56 T51 T50 S50 MONI FPC P C B...
Page 52: ...S 17 4 4 21 20 19 18 17 16 15 14 13 12 11 SDR T55 T56 T51 T50 S50 MONI FPC P C B...
Page 55: ...S 20...
Page 63: ...S7 2 LCD Section S 28 15 17 16 18 34 19 20 21 33 B17 B26 B27...
