9
3 Service Navigation
3.1.
Service Information
This service manual contains technical information which will allow service personnel’s to understand and service this model.
Please place orders using the parts list and not the drawing reference numbers.
If the circuit is changed or modified, this information will be followed by supplement service manual to be filed with original service
manual.
•
Microprocessor :
The following components are supplied as an assembled part.
• Microprocessor IC, IC2301 (RFKWMHTB550P).
•
SMPS Module :
Active Subwoofer (SB-HWA520) uses SMPS Module to supply the voltage & power required for the circuitries. It is
replaced as an assembly, do not attempt to replace or repair by individual components.
•
Bluetooth Module :
Bluetooth feature is not applicable in this model.