Lead-Free requirement for service
INDENTIFICATION:
Regardless of special logo (not always indicated)
One must treat all sets from 1.1.2005 onwards, according
next rules.
Important note: In fact also products a little older can also
be treated in this way as long as you avoid mixing
solder-alloys (leaded/ lead-free). So best to always use
SAC305 and the higher temperatures belong to this.
Due to lead-free technology some rules have to be
respected by the workshop during a repair:
x
Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solder-paste is
required, please contact the manufacturer of your
solder-equipment. In general use of solder-paste within
workshops should be avoided because paste is not easy
to store and to handle.
x
Use only adequate solder tools applicable for lead-free
solder alloy. The solder tool must be able
o
To reach at least a solder-temperature of 400°C,
o
To stabilize the adjusted temperature at the
solder-tip
o
To exchange solder-tips for different applications.
x
Adjust your solder tool so that a temperature around
360°C – 380°C is reached and stabilized at the solder
joint. Heating-time of the solder-joint should not exceed
~ 4 sec. Avoid temperatures above 400°C otherwise
wear-out of tips will rise drastically and flux-fluid will be
destroyed. To avoid wear-out of tips switch off un-used
equipment, or reduce heat.
x
Mix of lead-free solder alloy / parts with leaded solder
alloy / parts is possible but PHILIPS recommends
strongly to avoid mixed
solder alloy types (leaded and lead-free). If one cannot
avoid, clean carefully the
solder-joint from old solder alloy and re-solder with new
solder alloy (SAC305).
x
Use only original spare-parts listed in the
Service-Manuals. Not listed standard-material
(commodities) has to be purchased at external
companies.
x
Special information for BGA-ICs:
- always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for
de-soldering always use highest lead-free
temperature profile, in case of doubt)
- lead free BGA-ICs will be delivered in so-called
‘dry-packaging’ (sealed pack including a silica gel
pack) to protect the IC against moisture. After
opening, dependent of MSL-level seen on
indicator-label in the bag, the BGA-IC possibly
still has to be baked dry. This will be
communicated via AYS-website.
Do not re-use BGAs at all.
x
For sets produced before 1.1.2005, containing
leaded soldering-tin and components, all needed
spare-parts will be available till the end of the
service-period. For repair of such sets nothing
changes.
x
On our website:
www.atyourservice.ce.Philips.com
You find more information to:
BGA-de-/soldering (+ baking instructions)
Heating-profiles of BGAs and other ICs used in
Philips-sets
You will find this and more technical information
within the “magazine”, chapter “workshop news”.
For additional questions please contact your local
repair-helpdesk.
Notes
1-5
Summary of Contents for BDP3000
Page 43: ...Front Board Print layout Top and Bottom side 7 13 7 13 ...
Page 44: ...Power Board Print layout Bottom side Switch Board Print layout Bottom side 7 14 7 14 ...
Page 45: ...Power Board Print layout for BDP3000 93 Bottom side 7 14 7 14 ...
Page 46: ...Main Board Print layout Top side 7 15 7 15 ...
Page 47: ...Main Board Print layout Bottom side 7 16 7 16 ...
Page 55: ...REVISION LIST Version 1 0 Initial release for BDP3000 55 93 98 94 96 9 1 ...
