2003 Sep 19
18
Philips Semiconductors
Product Specification
VHF push-pull power MOS transistor
BLF278
Fig.22 Printed-circuit board and component layout for 225 MHz class-AB test circuit.
The circuit and components are situated on one side of the PTFE fibre-glass board, the other side being fully metallized to serve as an earth.
Earth connections are made by means of copper straps for a direct contact between upper and lower sheets.
Dimensions in mm.
handbook, full pagewidth
MBC436
119
130
100
Hollow
rivets
Hollow
rivets
strap
strap
strap
strap
strap
strap
strap
strap
R11
C38
C35
C37
C36
C16
IC1
L2
L1
R1
C1
C2
C3
C4
C5
L4
L5
C6
slider R2
slider R7
C13 R6
C12
C17
L10
L11
R4
R5
L8
L6
L7 L9
VDD1
C10 R3
C11
C8
to R2,R7
VDD1
VDD2
C9
C7
L17
R9
L17
C18
C25
C27
C26
C19
L12
C20
L13
C21
C28
L18
L19
L20
L21
C29
C31
C32
C30
C33
C34
R10
50
Ω
output
50
Ω
input
L23
L24
L3
L22
C14
C22
C23
L14
R8
L14
C15
C24
L15
L16