2003 Sep 19
3
Philips Semiconductors
Product Specification
VHF push-pull power MOS transistor
BLF278
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 60134).
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Per transistor section
V
DS
drain-source voltage
−
125
V
V
GS
gate-source voltage
−
±
20
V
I
D
drain current (DC)
−
18
A
P
tot
total power dissipation
T
mb
≤
25
°
C; total device; both
sections equally loaded
−
500
W
T
stg
storage temperature
−
65
150
°
C
T
j
junction temperature
−
200
°
C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th j-mb
thermal resistance from junction
to mounting base
total device; both sections
equally loaded.
max. 0.35
K/W
R
th mb-h
thermal resistance from
mounting base to heatsink
total device; both sections
equally loaded.
max. 0.15
K/W
Fig.2 DC SOAR.
Total device; both sections equally loaded.
(1) Current is this area may be limited by R
DSon
.
(2) T
mb
= 25
°
C.
handbook, halfpage
1
10
100
1
10
100
(1)
500
I
D
(A)
V (V)
DS
MRA988
(2)
Fig.3 Power derating curves.
Total device; both sections equally loaded.
(1) Continuous operation.
(2) Short-time operation during mismatch.
handbook, halfpage
0
40
80
160
500
0
400
MGE616
120
300
200
100
Ptot
(W)
Th (
°
C)
(2)
(1)