Philips DVP3320, Service Manual

Lead-Free requirement for service 

INDENTIFICATION: 

Regardless of special logo (not always indicated)         

One must treat all sets from 1.1.2005 onwards, according 

next rules.   

Important note: In fact also products a little older can also 

be treated in this way as long as you avoid mixing 

solder-alloys (leaded/ lead-free). So best to always use 

SAC305 and the higher temperatures belong to this. 

Due to lead-free technology some rules have to be 

respected by the workshop during a repair: 

x

 Use only lead-free solder alloy Philips SAC305 with 

order code 0622 149 00106. If lead-free solder-paste is 

required, please contact the manufacturer of your 

solder-equipment. In general use of solder-paste within 

workshops should be avoided because paste is not easy 

to store and to handle. 

x

  Use only adequate solder tools applicable for lead-free 

solder alloy. The solder tool must be able   

o

  To reach at least a solder-temperature of 400°C,     

o

 To stabilize the adjusted temperature at the 

solder-tip  

o

  To exchange solder-tips for different applications. 

x

 Adjust your solder tool so that a temperature around 

360°C – 380°C is reached and stabilized at the solder 

joint. Heating-time of the solder-joint should not exceed 

~ 4 sec. Avoid temperatures above 400°C otherwise 

wear-out of tips will rise drastically and flux-fluid will be 

destroyed. To avoid wear-out of tips switch off un-used 

equipment, or reduce heat. 

x

  Mix of lead-free solder alloy / parts with leaded solder 

alloy / parts is possible but PHILIPS recommends 

strongly to avoid mixed   

solder alloy types (leaded and lead-free). If one cannot 

avoid, clean carefully the   

solder-joint from old solder alloy and re-solder with new 

solder alloy (SAC305). 

x

  Use only original spare-parts listed in the 

Service-Manuals. Not listed standard-material 

(commodities) has to be purchased at external 

companies. 

x

Special information for BGA-ICs:

- always use the 12nc-recognizable soldering 

temperature profile of the specific BGA (for 

de-soldering always use highest lead-free 

temperature profile, in case of doubt)   

- lead free BGA-ICs will be delivered in so-called 

‘dry-packaging’ (sealed pack including a silica gel 

pack) to protect the IC against moisture. After 

opening, dependent of MSL-level seen on 

indicator-label in the bag, the BGA-IC possibly 

still has to be baked dry. This will be 

communicated via AYS-website. 

Do not re-use BGAs at all. 

x

For sets produced before 1.1.2005, containing 

leaded soldering-tin and components, all needed 

spare-parts will be available till the end of the 

service-period. For repair of such sets nothing 

changes. 

x

 On our website: 

www.atyourservice.ce.Philips.com

You find more information to:   

BGA-de-/soldering (+ baking instructions) 

Heating-profiles of BGAs and other ICs used in 

Philips-sets 

You will find this and more technical information 

within the “magazine”, chapter “workshop news”. 

For additional questions please contact your local 

repair-helpdesk. 

Notes

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