Philips Semiconductors
SC16C2550
Dual UART with 16 bytes of transmit and receive FIFOs and IrDA
encoder/decoder
Product data
Rev. 03 — 19 June 2003
39 of 46
9397 750 11621
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
11. Package outline
Fig 17. DIP40 package outline (SOT129-1).
UNIT
A
max.
1
2
b
1
c
D
E
e
M
H
L
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT129-1
99-12-27
03-02-13
A
min.
A
max.
b
Z
max.
w
M
E
e
1
1.70
1.14
0.53
0.38
0.36
0.23
52.5
51.5
14.1
13.7
3.60
3.05
0.254
2.54
15.24
15.80
15.24
17.42
15.90
2.25
4.7
0.51
4
0.067
0.045
0.021
0.015
0.014
0.009
2.067
2.028
0.56
0.54
0.14
0.12
0.01
0.1
0.6
0.62
0.60
0.69
0.63
0.089
0.19
0.02
0.16
051G08
MO-015
SC-511-40
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w
M
b
1
e
D
A
2
Z
40
1
21
20
b
E
pin 1 index
0
5
10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
(1)
(1)
(1)
DIP40: plastic dual in-line package; 40 leads (600 mil)
SOT129-1