1999 Oct 12
16
Philips Semiconductors
Product specification
IC card interface
TDA8002C
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); note 1.
Note
1. Stress beyond these levels may cause permanent damage to the device. This is a stress rating only and functional
operation of the device under this condition is not implied.
HANDLING
Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.
Method 3015 (HBM 1500
Ω
, 100 pF) 3 positive pulses and 3 negative pulses on each pin with respect to ground.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
DDD
digital supply voltage
−
0.3
+6.5
V
V
DDA
analog supply voltage
−
0.3
+6.5
V
V
CC
card supply voltage pins;
XTAL1, XTAL2, ALARM, CS, MODE,
RSTIN, CLKSEL, AUX2UC, AUX1UC,
CLKDIV1, CLKDIV2, CLKOUT,
STROBE, CMDVCC, CV/TV and OFF
−
0.3
+6.5
V
V
i(card)
input voltage on card contact pins;
I/O, AUX2, PRES, PRES, AUX1, CLK,
RST and V
CC
−
0.3
+6.5
V
V
es
electrostatic handling voltage
on pins I/O, AUX2, PRES, PRES,
AUX1, CLK, RST and V
CC
−
6
+6
kV
on all other pins
−
2
+2
kV
T
stg
storage temperature
−
55
+125
°
C
P
tot
continuous total power dissipation
TDA8002CT/x
T
amb
=
−
25 to +85
°
C
−
0.56
W
TDA8002CG
T
amb
=
−
25 to +85
°
C
−
0.46
W
T
amb
ambient temperature
−
25
+85
°
C
T
j
junction temperature
−
150
°
C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-a)
thermal resistance from junction to ambient
in free air
SOT136-1
70
K/W
SOT401-1
91
K/W