Phoenix MicroATX Express Installation Manual Download

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Phoenix MicroATX Express – Installation Guide

The continued push of technology to increase performance levels (higher operating speeds) and packaging density
(more transistors) is aggravating the thermal management of the CPU. As operating frequencies increase and
packaging sizes decreases, the power density increases and the thermal cooling solution space and airflow become
more constrained. The result is an increased importance on system design to ensure that thermal design requirements
are met for the CPU.

The objective of thermal management is to ensure that the temperature of the processor is maintained within
functional limits. The functional temperature limit is the range within which the electrical circuits can be expected to
meet their specified performance requirements. Operation outside the functional limit can degrade system
performance, cause logic errors or cause component and/or system damage. Temperatures exceeding the maximum
operating limits may result in irreversible changes in the operating characteristics of the component.

If the Phoenix MicroATX Express industrial embedded motherboard is acquired without the CPU and the thermal
solution, extremely care must be taken to avoid improper thermal management. All Intel thermal solution
specifications, design guidelines and suggestions to the CPU being used must be followed. The Phoenix MicroATX
Express warranty is void if the thermal management does not comply with Intel requirements.

Be sure that there is sufficient air circulation across the
processor’s heatsink and CPU cooling FAN is working
correctly, otherwise it may cause the processor and
motherboard overheat and damage, you may install an
auxiliary cooling FAN, if necessary.

Designing for thermal performance

In designing for thermal performance, the goal is to keep the processor within the operational thermal specifications.
The inability to do so will shorten the life of the processor.

Fan Heatsink

An active fan heatsink can be employed as a mechanism for cooling the Intel processors. This is the acceptable
solution for most chassis. Adequate clearance must be provided around the fan heatsink to ensure unimpeded air
flow for proper cooling. Use a plastic cooler back plate when installing the fan cooler assembly on to the CPU

Airflow management

It is important to manage the velocity, quantity and direction of air that flows within the system (and how it flows)
to maximize the volume of air that flows over the processor.

Thermal interface management

To optimize the heatsink design for the Pentium 4 processor, it is important to understand the impact of factors
related to the interface between the processor and the heatsink base. Specifically, the bond line thickness, interface
material area, and interface material thermal conductivity should be managed to realize the most effective thermal
solution.
Once used, the thermal interface should be discarded and a new one installed. Never assemble the heatsink with a
previously used thermal interface.

LGA 775 CPU Installation Guide

Socket Preparation

1. Opening the socket:

Note: Apply pressure to the corner with right hand thumb while opening/closing the load lever, otherwise lever
can bounce back like a “mouse trap” and WILL cause bent contacts (when loaded).

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