GF-RK3399-Kit Embedded Development Hardware Manual
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CPU, LPDDR4, eMMC, power management chip, etc. It adopts Gold Finger (317Pins) Interface
leads to function pins, which fully expanded the hardware resources of RK3399. And different
interface functions can be multiplexed and combined according to the pin conditions to make a
backplane that meets the requirements.
Picture 2
◆
Onboard Rockchip RK3399 processor;
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Onboard 2GB LPDDR4, 8GB EMMC (Std);
◆
The Core Board adopts 8-layer PCB with high-precision gold immersion process;
◆
Core Board size: 82mm*63mm, suits for various embedded occasions;
◆
Core Board
Gold Finger Connector:
317 Pins lead out the core board resources;
◆
Using 5V power supply, onboard power management chip. Core board power consumption is less
than 2W;
◆
Support Android7.1;
For the Pin definition of the Core Board, please refer to the Base Board interface function section.
