GF-RK3399-Kit Embedded Development Hardware Manual
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Voice
2-ch Speaker out
1-ch earphone output
1-ch MIC input
Storage
1-ch TF card
Expansion
1-ch I2C interface, 8-ch GPIO interface
Others
Reset, Watch Dog, RTC
Power Supply
+12V power input
S
oft
ware
R
esou
rce
s
Development
Tools
Development environment: virtual machine VM9.02+Ubuntu 14.04 or Ubuntu
16.04 system
Application layer development and debugging tools
Cross compiler
Common terminal development and debugging tools
System Image
Image file corresponding to the operating system
Test Program
Interface application demo test program and test program source code
Source Code
Bootloader, kernel, file system source code
Manuals
Hardware manual, test manual, device manual,
Mechanical
Chart
Base Board structural drawing (DXF file)
E
le
ct
ric
a
l
Spe
cif
ic
at
ion
Layer/Size
Core Board size: 82mm*63mm, 8-layer board high-precision immersion gold
process
Base Board size: 158mm*120mm, 4-layer board high-precision immersion gold
process
Power
Consumption
Power consumption
≤
5W (Whole Board, no load power consumption)
Operation
Temperature
0
℃
~ +60
℃
Storage
Temperature
0
℃
~ +60
℃
Working
Humidity
5% to 95%, non-condensing
Core
Board
Configuration
2GB DDR/8GB EMMC (Std.)
4GB DDR/16GB EMMC (Opt.)
2.3.Core Board Resources
GF-RK3399-CM core board adopts 8-layer PCB board high-precision immersion gold process, high
TG board, with reliable electrical performance and anti-interference performance. It has integrated
