LTE-A Module Series
EG12 Hardware Design
EG12_Hardware_Design 84 / 97
or the opposite side of the PCB area where the module is mounted, or both of them.
The heatsink should be designed with as many fins as possible to increase heat dissipation area.
Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and
module/PCB.
The following shows two kinds of heatsink designs for reference and customers can choose one or both
of them according to their application structure.
Heatsink
EG12 Module
Application Board
Application Board
Heatsink
Thermal Pad
Shielding Cover
Figure 42: Referenced Heatsink Design (Heatsink at the Top of the Module)
Thermal Pad
Heatsink
Application Board
Application Board
Heatsink
Thermal Pad
EG12 Module
Shielding Cover
Figure 43
: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)