LTE-A Module Series
EG12 Hardware Design
EG12_Hardware_Design 16 / 97
1. "*" means under development.
2.
1)
Within operating temperature range, the module is 3GPP compliant.
3.
2)
Within extended temperature range, proper mounting, heating sinks and active cooling may be
required to make certain functions of the module such as voice, SMS, data transmission, emergency
call to be realized. Only one or more parameters like Pout might reduce in their value and exceed the
specified tolerances. When the temperature returns to normal operating temperature levels, the
module will meet 3GPP specifications again.
2.3. Functional Diagram
The following figure shows a block diagram of EG12 and illustrates the major functional parts.
Power management
Baseband
LPDDR2 SDRAM+NAND Flash
Radio frequency
Peripheral interfaces
Firmware Upgrade
USB 2.0 interface and DFOTA
RoHS
All hardware components are fully compliant with EU RoHS directive
NOTES