LTE Standard Module Series
EG25-GL_Hardware_Design 88 / 96
Table 38: Recommended Thermal Profile Parameters
1. If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing into
the module.
2. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module.
3. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for
any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic
soldering) that is not mentioned in
document [8]
8.3 Packaging Specifications
This chapter describes only the key parameters and process of packaging. All figures below are for
reference only. The appearance and structure of the packaging materials are subject to the actual
delivery.
The module adopts carrier tape packaging and details are as follow:
Factor
Recommendation
Soak Zone
Max slope
1
–3 °C/s
Soak time (between A and B: 150 °C and 200 °C)
70
–120 s
Reflow Zone
Max slope
1
–3 °C/s
Reflow time (D: over 217 °C)
40
–70 s
Max temperature
235 °C to 246 °C
Cooling down slope
-1.5 to -3 °C/s
Reflow Cycle
Max reflow cycle
1
NOTE
