Wi-Fi&BT Module Series
FC21 Hardware Design
FC21_Hardware_Design 48 / 52
Table 31: Recommended Thermal Profile Parameters
During manufacturing and soldering, or any other processes that may contact the module directly,
NEVER wipe the module label with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol,
trichloroethylene, etc. Otherwise, the label information may become unclear.
Factor
Recommendation
Soak Zone
Max slope
1–3 °C/s
Soak time (between A and B: 150 °C and 200 °C)
70–120 s
Reflow Zone
Max slope
2–3 °C/s
Reflow time (D: over 220°C)
45–70 s
Max temperature
238 °C to 246 °C
Cooling down slope
-1.5 to -3 °C/s
Reflow Cycle
Max reflow cycle
1
NOTE