Smart Module Series
SC690A_Series_Hardware_Design 101 / 105
Table 54: Recommended Thermal Profile Parameters
1. If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing into
the module.
2. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the
module.
3. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for
any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic
soldering) that is not mentioned in
document [4]
Factor
Recommendation
Soak Zone
Max slope
1
–3 °C/s
Soak time (between A and B: 150
°C
and 200
°C
)
70
–120 s
Reflow Zone
Max slope
2
–3 °C/s
Reflow time (D: over 217
°
C)
40
–70 s
Max temperature
235
–246 °C
Cooling down slope
-1.5 to -3 °C/s
Reflow Cycle
Max reflow cycle
1
NOTE
