USER MANUAL
4
2.3.
Specification
Power
1000W
Voltage
230V 50HZ/60HZ
Temperature range
100
℃
-500
℃
Airflow range
1 – 50 l/min.
Size (L*D*H)
18
（
L
）
*210
（
D
）
*130
（
H
）
mm
Weight
2.6kg
2.4.
Applications
1.
It is suitable to the de-soldering of the SMD components, such as SOIC,
CHIP, QFP, PLCC, BGA and so on.
2.
It is suitable to hot shrink, drying, remove lacquer and mucosity, thaw,
preheating, disinfect and so on.
3.
It is suitable for the situation needing different range airflow, softer or
heavier.
4.
It is suitable for the hot air lead free de-soldering.
2.5.
Temperature and air flow
1.
Firstly, place the SMD rework system on the workbench. And then
connect well the power cord and other connection lines. Place the
handle on the handle holder before switching on the power supply.
2.
The handle holder must be installed when the machine is used for the
first time, as shown in the picture on the right.
