QUICK2025 manual operation
Page 18
PCB between Top heater and Bottom heater (the soldered elements have been placed on the PCB board by
PL system). The position of the soldered BGA must be corresponding with the position of the sirocco
nozzles.
3
．
Adjust aperture system for getting a proper window size.
4
．
Select parameters with keyboard. (Refer to Parameters setting)
A
．
Select the required flow, if need to modify the parameter, input the password before performing
relevant operation.
B
．
Select “solder” working mode.
C
．
No change in communication speed, and press “SAVE” button to save and exit to MAIN surface.
D
．
System starts working after pressing “BEGIN”, running the select flow
5
．
LCD will display series of setting temperatures and the current temperature of TB and TC during working,
and indicate when it reaches T1, T2, T3 and TL. S1, S2 and S3 are counted down and user can know about
the setting value clearly.
6
．
When the temperature reaches TL, there will be a sound signal (if setting alarming).
7
．
When the temperature reaches T3, the sound signal changes to a briefness sound and the system stops
heating for seconds of S3. After that, the system will not heat up anymore and exit the process
automatically and then the technical process is over.
8. The system can perform a series of function action during working.
A
．
After press BEGIN key, the top infrared heater move downward near to bottom.
B
．
After the system sounds unvaryingly, the top heater move upwards. Top cooling fan blows cooling air
and bottom sirocco nozzle stop blowing warm air to blow cooling air. The effect of cooling is better
when blowing cooling air simultaneously.
C
．
The top cooling fan and bottom sirocco stop blowing after 50 seconds, and the soldering technics is
over.
Note:
The process of the De-soldering technics is same with the soldering technics besides selecting “DESO”
when setting the process parameter.
9.2
Aligning Technics
1
．
Turn on power switch of each part.
2
．
Press “CAM-CON” key and move the alignment arm to aligning position. The lights of up and down both
are on.
3
．
Place the component above the prism of the alignment arm.
4
．
Suck the chip automatically and back to aligning position after pressing “SUCK” key. Manual operation is
also convenient.
5
．
Check whether the image displayed on Monitor fitting user’s demand. Use keyboard to adjust it. Adjusting
refers to “Keyboard Instructions”.
6
．
Unscrew the PCB Fixing Knobs on the PCB Fixture to open PCB Clamp Bar. Fix the soldered PCB on the
PCB Fixture and adjust PCB’s position to the below of the aligning arm. Make the Monitor display the
image of soldering point, and make the images of soldering point and component in the same center point.
It is convenient for adjusting. After roughly adjusting, screw down Fixture Fixing Knob to lock PCB
Fixture to prevent it from sliding right and left.
7
．
Align the component with two Adjusting Knobs and two Micro-adjusting Knobs. Make the images of the
component soldering pins and the soldering point on PCB overlap. The image can be observed on the
