QUICK2025 manual operation
4. Safety Instructions
Note:
For the safety of the system and operator, please read this manual carefully before operating the unit.
Please note that the unit is suitable for soldering and de-soldering of electronic components.
Note:
Top and bottom infrared heater and sirocco nozzle will be very hot during working, so explosive and
combustible object or gas and solvent is strictly prohibited in working areas, also please don’ touch the
hot surface parts.
This equipment must be grounding when using.
Note:
The laser alignment device includes a secondary laser device, so don’t see the laser bean directly.
Note:
When the system in trouble and needs maintenance, it should be maintained by an experienced and
authorized technician or expert, or contact with service agent and factory.
The unit with dangerous voltage! The inexperienced maintenance is dangerous for the operators.
5. Specifications and Technical Parameters
5.1 Specification
1. General Power 3500W (Max)
2. Power of Bottom Heater 1800W (4*450W Infrared ceramic heating tube)
3. Power of Top Heater 960W (8*120W)
2~8µm Approx
4. Power of Bottom Sirocco Heater 700W
5. Adjusting Range of Top Heater 20~60mm
6. Preheating size of bottom radiate board 450mm*648mm
7. Maximal PCB size 500mm*600mm
Minimal BGA size 2*2mm
Maximal
chip size 60*60mm
8. bottom cooling fan
9. LCD Display Screen Size: 100*75 (mm) 16
×
2 character
10. Communication Standard RS-232C (Connect with PC)
11.Infrared Temperature sensor 0~300
℃
(temperature testing range)
12.Outside K Type Sensor 5pieces
13. Camera 12V/300mA
Horizontal resolution: 480 TV lines
PAL format (composite)
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