BGA2015 OPERATION MANUAL
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8.3.1Soldering Technics
1.
Turn on power switch of each part.
2.
Move PCB Fixture with fixed PCB and make it above the Bottom Radiator and make the
soldered component on the PCB between Top Radiator and Bottom Radiator. The position is
easy to be measured with laser alignment device. The right position should make the red
laser point in the center of component.
3.
Adjust aperture system, and get a proper window size.
4.
Adjust RPC in appropriate place, adjust size and focus of image with PL keyboard to
display component image in the monitor clearly.
5.
Select parameter with keyboard. (Refer to Parameters setting)
A.
Input password ”000”
B.
Select the required flow, if need to modify, perform relevant operation.
C.
Select “solder” working mode.
D.
Select “IR” laser alignment mode.
E.
No change to communication speed, and press
EXIT key to exit. IR window shows:
F.
Press “START” key
，
and the system start working, perform content of selected flow.
6.
IR window will display series of setting temperatures and the current temperature of Tb and
TC during working, and indicate when it reaches T0, T1, T2, T3 and TL. S1, S2 and S3 are
counted down and user can know about the setting value clearly.
7.
If you see the solder has melted down (It is watched with RPC and Monitor), you can press
CAL key to calibrate temperature of TL to adjust the display temperature to liquid
temperature TL.
8.
When the temperature reaches TL, there will be a voice signal.
9.
When the temperature reaches T3, the sound signal changes to a briefness sound and the
system delays heating by S3 seconds. After that, the system will not heat up anymore and
exit the process automatically, the technical process is over.
10.
The system can perform a series of function action during working.
A.
After press START key, the top heater move downwards near to bottom.
B.
After the system sounds unvaryingly, the top heater move upwards and Top Cooling
Fan and Outside Cooling Fan spread out to blow cooling air simultaneously.
C.
After 150 seconds, the two Cooling Fns stop blowing, and the soldering technics has
been finished.
8.3.2 De-soldering Technics
1.
Turn on power switch of each part.
2.
Fix the PCB on the top of Bottom Heater and make the de-soldered component between Top
TC:022˙C Tb:019˙C
ready for flow
