QUICK EA-A10 OPERATION MANUAL
Page 11
9、Description of the process
Note: The top and bottom heater will be very hot during working, so please don’
touch the hot surface of the parts.
9.1 place height and suck height
1.
Place height:
after setting one time, place height be save and memory, Do not adjust focus every times for
the same BGA chip.(the next time effect which parameter save to current flow)
Place height
：
after setting once, no pressure place height be save and memory, to the same specification BGA
chip, when solder, do not setting place height every time can realize no pressure place..( the next time effect
which parameter save to current flow)
2.
Aligning height setting:
（
1
）
、
after PCB focus right, suck chip, enter aligning operation interface, rotate “YELLOW” knob, turn off
yellow light, rotate BLUE, open blue light.
（
2
）
、
rotate “Z” knob adjust the height of chip, make the picture of chip the best distinct.
（
3
、
）
now, can click “aligning height” , and then enter parameter setting interface, save to appoint parameter,
setting complete.
3.
Place height setting:
（
1
）
、
after suck chip , rotate “Z” knob, make chip approach PCB, when chip achieve the best place height,
click software “aligning operation” “place height”, this place height be memory . and then enter parameter
setting interface, save to appoint parameter, setting complete.
（
2
）
、
when place, reach the place height then auto stop vacuum pump, place BGA chip on the surface of
PCB.
note：under common condition, aligning height according to just contact PCB.
9.2 soldering technology
1.
Place need solder PCB to PCB studdle
（
If PCB irregular, can use dysmorphism support
）
.
2.
Screw fixed knob of PCB holder.
3.
Shake the rocker, move PCB ban, make laser shine in the middle of BGA pad.
4.
Put the waiting soldering BGA chip on suck mouth, attention the direction of chip.
5.
Photology aligning. Detail see “9.1”.
6.
Click “operation interface”, select goal flow, then select “solder”, and then click “start”, auto place chip, start
solder.
7.
After solder finish , must cool PCB ban , please do next solder flow after cool down.
8.
And then again one to six step as follow.
