QUICK EA-A10 OPERATION MANUAL
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1. Summary
Thank you for using QUICK BGA EA-A10 Rework System. This system, have increase base heating power
to original system , which adopts micro-processor control and infrared sensor technology to do soldering and
de-soldering to surface mount components safely and accurately, increases bottom heating power based on the
original one. It can also control the whole technical process and record all the information by means of the IR
Software, thus meeting the higher technical demands of modern electronic industry. It becomes one of the most
valued electronic equipments in this field.
QUICKEA-A10 Rework System adopts hot airflow technology and closed–loop principle, integrating
harmoniously the infrared preheater and the sirocco heater together. In order to control the soldering process
optimally and get the nondestructive and reproductive PCB temperature, QUICKEA-A10’s heating power is up to
4200W and the heating power can be adjustable.
With K-type sensor controls the surface temperature of the BGA. For more preciseness technics demands
and effectual controlling the PCB temperature and the encapsulation temperature, the technology of re-flow
soldering controlled by closed-loop ensures the precise and smaller technical window, even heat distribution and
appropriate peak value of temperature for lead-free soldering. Besides, the infrared preheater is suitable for all
applications, such as large or small PCB and lead-free solder, moving automatically in X-axis to heating the PCB
evenly.
For reducing the manual effects, QUICK EA-A10 BGA rework system can automatically run the processes
except adjusting X
、
Y
、θ
with hand, but with the precise motor for precise alignment. Besides, the chip sucking
and pasting, lens moving, reflow controlling, heating moving and chip de-solder are all automatic controlled by
the step motor. And the system has the controlling software with wide screen display of LCD to multi-control the
processes unaided or by the outer computer.
The new BGA rework system has the advantages of the infrared heater and sirocco heater, satisfying the
demands of reworking the BGA, especially in lead-free soldering.
