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QUICK    EA-A10    OPERATION MANUAL                                                                                                                       

                                                                                                               

Page 3 

4. Safety Instructions 

Note: 

  For the safety of the system and operator, please read this manual carefully before operating the unit. 

            Please note that the unit is suitable for soldering and de-soldering of electronic components. 

 

Note: 

 Top  and  bottom  infrared  heater  and  sirocco  nozzle  will  be  very  hot  during  working,  so  explosive  and 

combustible object or gas and solvent is strictly prohibited in working areas, also please don’ touch the hot 

surface parts. 

          This equipment must be grounding when using. 

 

Note: 

  The laser alignment device includes a secondary laser device, so don’t see the laser bean directly.   

 

Note: 

When  the  system  in  trouble  and  needs  maintenance,  it  should  be  maintained  by  an  experienced  and 

authorized technician or expert, or contact with service agent and factory. 

The unit with dangerous voltage! The inexperienced maintenance is dangerous for the operators.

 

 

 

5. Specifications and Technical Parameters 

5.1 Specifications 

1.

 

Power:                                                                    4200W

max

 

2.

 

Voltage:                                                                  220V/230V AC

  50/60HZ 

3.

 

Power of top Heater:                                              1200W 

4.

 

Power of Bottom infrared preheater:

                  400W*4=1600W

infrared heat

 

5.

 

Power of Bottom Sirocco Heater

                        1200W 

6.

 

Temperature of the Sirocco Heater:                       

3.5 m

3

/min 

7.

 

Temperature of the infrared heater:                        400

℃(

MAX

 

8.

 

Preheating temperature range:                                400

℃(

MAX

 

9.

 

Size of the infrared heater:                                      290mm*3240mm 

10.

 

Maximal PCB size:                                                  380mm*260mm 

11.

 

Chip size range:                                                        2*2mm ~60*60mm     

12.

 

Placement precision                                                 

±

0.02mm 

13.

 

Placement force                                                        1.5N / zero pressure placement   

two mode realize

 

14.

 

Camera

                                                                  12V/300mA

 

22*10        Horizontal resolution: 480 TV lines 

                                                                                        PAL format (composite) 

15.

 

LED light:                        White LED (lower side), Red LED (upper side) (with adjustable brightness) 

16.

 

communicate

                                  USB 

can connect to PC

 

17.

 

Bump

                                          12V/300mA,    0.05Mpa

max

 

18.

 

K-type sensor

                                5

 

Summary of Contents for EA-A10

Page 1: ...you for purchasing our BGA SMD Rework System The system is exclusively designed for reworking and soldering SMD component Please carefully read this manual before operating the system Store this manu...

Page 2: ...Fixture and Movement Controlling 5 7 4 Keys Instructions 6 7 5 Aligning Arm Instruction 7 7 6 Nozzle Instruction 7 8 Technology Process 8 8 1 Process of Sucking the Chip 8 8 2 solder flow of chip 9 8...

Page 3: ...h K type sensor controls the surface temperature of the BGA For more preciseness technics demands and effectual controlling the PCB temperature and the encapsulation temperature the technology of re f...

Page 4: ...m Sirocco nozzle 50 50 36 36 2 pcs Video line 1 pcs USB line 1 pcs K type sensors 5 pcs BGA Toolbox 1 pcs Note The parts will be packed according to the packing list If you don t purchase the optional...

Page 5: ...ert or contact with service agent and factory The unit with dangerous voltage The inexperienced maintenance is dangerous for the operators 5 Specifications and Technical Parameters 5 1 Specifications...

Page 6: ...of the bottom infrared heater BUM Pump is in working mode or not FAN The nearside cooling fan is in working mode or not HED the position of the top heater UP DOWN UNKN ALG the position of the contrapo...

Page 7: ...d heater is 1600W 7 3 PCB Fixture and Movement Controlling Bottom Preheater and the PCB Fixture The adjustable infrared heater can provide even quantity of heat for the PCB and protect the PCB from di...

Page 8: ...il move left and right move rocker front and back then realize the PCB move front and back 2 When proceed count point not need press rocker spin it direct can realize chip 360 rotate then finish count...

Page 9: ...lace and suck chip 2 Turn the rocker when optics alignment to make the sucked BGA by the nozzle turning until the stannum ballpoint in the BGA is superposable with the cuprum point in the PCB During t...

Page 10: ...to suck the chip and then move upward At the time the Alignment adjust By the rocker the ZOOM keys and the FOCUS keys The image is clear or not Has completed the alignment or not Chip solder Technolog...

Page 11: ...o heater of top and bottom comes to heat The flow of D1 D6 finishes The nozzle acts upwards after into the COOL flow and the cool fan comes to blow and cool the PCB And the time the moving arm will mo...

Page 12: ...cool fan End Start desolder The moving arm will move slowly when near the chip Run the vacuum automatically and suck the chip before 20 seconds ending the flow D6 Are there abnormal cir s during the...

Page 13: ...eight and then enter parameter setting interface save to appoint parameter setting complete 3 Place height setting 1 after suck chip rotate Z knob make chip approach PCB when chip achieve the best pla...

Page 14: ...atically and come back to aligning position after pressing SUCKER key Manual operation is also convenient 5 Unscrew the fixing screws of the PCB fixture and adjust the distance between the PCB fixing...

Page 15: ...t using dry or wet towel to clean the equipment Solder on the glass of Bottom Radiator can be cleaned out with hard object Please be careful not to break down the glass 3 Clean the prism of camera wit...

Page 16: ...flow file K type sensor KT1 KT5 only connect K type temperature sensor can display temperature Flow curve display window temperature curve of KT1 KT5 easy to real time watch and curve analysis Flow st...

Page 17: ...mplify picture of display window Reduction reduce picture of display window focus magnify picture focus focus reduce picture focus Heat arm up click heat arm move up press on continuous heat arm move...

Page 18: ...play we can do solder or desolder testing Counterpoint height memory setting height After setting auto memory this height the same specification chip counterpoint call save flow do not need adjust cou...

Page 19: ...1 4 curve analysis display 1 Curve analysis display this display can analysis KT1 KT5 flow curve know peak temperature of this flow temperature rise slope temperature change of every heat process and...

Page 20: ...ware and modify parameter If not set parameter protect password people who obtain enter password also modify parameter Language version select can select language china or English Select Chinese then...

Page 21: ...Changzhou Quick Soldering Co Ltd Add No 11 FengXiang Road Wujin High Tech Industrial Development Zone Jiangsu China Tel 86 519 86225678 Fax 86 519 86558599 Zip code 213167 Website www quick global com...

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