USER MANUAL
5
2.4.
Application
1.
It is suitable for soldering and desoldering various kinds of
components such as SOIC, QFP, PLCC, BGA chips.
2.
It is suitable for heat shrinkage, paint and sticker removal,
preheating, sterilizing, glue connecting etc.
2.5.
Temperature Setting
1.
Under the condition of switching on power, press the “
▲
” or “
▼
”
keys and display window will show the set temperature.
2.
Press the “
▲
” key once, the set temperature will raise 1
℃
and
the display window will show the set temperature. Press the “
▼
”
key once, the set temperature will drop 1
℃
. If press the “
▲
” or
“
▼
” key and not to loosen, the set temperature will raise or drop
rapidly. After loosening it, actual temperature or “–––” will be
displayed and the unit enters standby mode after the set
temperature is displayed for two seconds.
860DA nozzle retaining plate