Q150T Sample Preparation System
Q150T - Instruction Manual
3
10473 - Issue 5
Contents
Section Contents
1
Introduction .......................................................................................................... 8
1.1
General Description ......................................................................................... 8
1.2
Sputter Coating ................................................................................................ 9
1.3
Carbon Coating................................................................................................ 9
1.4
Metal Evaporation ............................................................................................ 9
1.5
Aperture Cleaning ............................................................................................ 9
2
Installation .......................................................................................................... 10
2.1
Pre-installation ............................................................................................... 10
2.1.1
Required Services .......................................................................................................10
2.2
Unpacking...................................................................................................... 11
2.3
Connections................................................................................................... 12
2.3.1
Gas Connections ........................................................................................................13
2.3.2
Electrical Connections.................................................................................................14
2.3.3
Aux Network Connection.............................................................................................14
2.3.4
Vacuum Connections ..................................................................................................15
2.3.5
Fitting the Standard Stage...........................................................................................16
2.3.6
Optional Connections ..................................................................................................16
3
Operation ............................................................................................................ 17
3.1
Switching On for the First Time ...................................................................... 17
3.1.1
The Standby screen ....................................................................................................17
3.2
Running a Profile ........................................................................................... 18
3.3
System Settings ............................................................................................. 20
4
Working with Profiles......................................................................................... 21
4.1
Editing the Active Profile ................................................................................ 21
4.2
Profile Editor .................................................................................................. 21
4.2.1
Creating a New Profile ................................................................................................23
4.2.2
Editing Profile Parameters...........................................................................................24
4.3
Materials ........................................................................................................ 25
4.3.1
Creating a New Material ..............................................................................................26
4.3.2
Editing Material Parameters ........................................................................................26
4.3.3
Deleting a Material.......................................................................................................27
5
Application Guidelines ...................................................................................... 28
5.1
QT Timed Sputter .......................................................................................... 28
5.1.1
Tungsten SEM work....................................................................................................28
5.1.2
High resolution SEM coatings for field emission SEM ................................................28
5.1.3
Aluminium thin film......................................................................................................29
5.2
QT FTM Terminated Sputter........................................................................... 30
5.2.1
High resolution SEM coatings for field emission SEM ................................................30
5.2.2
General thin film coatings............................................................................................30
5.3
Metal Evaporation .......................................................................................... 31
5.3.1
How to achieve a 20nm gold coating ...........................................................................31
5.4
Pulsed Cord Evaporation................................................................................ 32
5.4.1
How to create a 20nm carbon coating .........................................................................32
5.5
Controlled Pulse Cord Evaporation................................................................. 32
5.5.1
Using Controlled Pulse to create a 15nm coat or 2-3nm for EBSD.............................32
5.6
Pulsed Rod Evaporation................................................................................. 34
5.6.1
How to create a conductive layer for SEM...................................................................34
5.7
Ramped Profile .............................................................................................. 35
5.7.1
Carbon insert setup.....................................................................................................35
5.7.2
The ramped current profile..........................................................................................36
5.7.3
Adjusting coating thickness.........................................................................................37
5.7.4
How to create a carbon support layer For TEM...........................................................37
How to create a conductive carbon layer for SEM ....................................................................38
5.8
Using Outgas Source options ......................................................................... 39
5.8.1
Setting Outgas Source options ...................................................................................39
5.8.2
Running Multiple Outgassing ......................................................................................39
5.9
Glow Discharge.............................................................................................. 40
5.9.1
Hydrophilisation...........................................................................................................40
5.9.2
Surface Cleaning.........................................................................................................40
Summary of Contents for Q150T S
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