Q150T Sample Preparation System
Q150T - Instruction Manual
45
10473 - Issue 5
6.2.2
Generic Sputter
This option allows you to change the default settings used during sputter coating
sequences. The Q150T uses these settings in all profiles of type:
Timed Sputter
and
FTM Terminated Sputter
unless overridden in the profile (see page 83).
To change the settings, tap on
Generic Sputter
and then tap on the
Edit
button. The
Generic Sputter
properties are displayed (see
Figure 6-4
and
Table 13
).
Figure 6-4.
Generic sputter parameters
Table 13
Generic Sputter parameters
Name
Default
Value
Minimum
Value
Maximum
Value
Comment
Gas Bleed Time
(Seconds)*
15
0
20
Time Ar allowed to flow into
chamber before plasma started
Bleed Vacuum*
1x10
-2
5x10
-3
5x10
-1
Pressure at which the chamber
is maintained at while the
plasma is present
Clean Current
(mA)*
150
100
150
Current at which the target is
cleaned at.
Clean Time
(Seconds)*
30
0
60
Time for which the target is
cleaned for
Clean Discharge
time (Seconds)*
20
15
90
Only used during pulse cleaning
of target. Time allowed for the
tagert to discharge after the
clean time
Max pulse clean
cycles*
2
25
15
Only used during pulse cleaning
of target. Specifes maximum
number of repeated pulse
cleaning cycles that can carried
out before the process is aborted
* Admin group level required to edit this property
1.
To edit a parameter, tap on its value.
2.
Change the value as required. The instrument displays a dialog box for editing
purposes, with either a numeric keypad or keyboard as required. The dialog box
also shows the allowed values for the parameter.
3.
When you edit a value, click on the
OK
button to confirm the change or on the
Cancel
button to restore the previous value.
4.
Edit other parameters as required.
5.
Back on the
Generic Sputter
page, click on the
OK
button to confirm the changes
or on the
Cancel
button to restore the previous values.
Summary of Contents for Q150T S
Page 92: ......
