Technical Data
30
EPC-2322 (P3000(D)BX2 Series)
Service Manual
Specifications
Overview
Listed in the tables below are system specifications and environmental tolerances for
the P3000(D)BX2 series SBC.
Note:
These specifications are subject to change without notice.
Environmental
Environmental tolerances are listed in the following table:
Cooling
Airflow requirements for the SBC are listed in the following table:
Note:
The following table lists the minimum unimpeded airflow in linear feet per
minute (LFM) required across the processor for operations at the specified ambient
temperature at sea level.
Operating
Non-Operating
Temperature
5 to 53 °C (41 to 127.4 °F)
at 200 LFM
†
-40 to 70 °C (-40 to 158 °F)
Humidity
5 — 95% @ 40 °C,
non-condensing
0 — 95% @ 40 °C,
non-condensing
Shock
1 G @ 10 ms
30 G @ 10 ms
Vibration
0.25 G @ 5 — 150 Hz
2.5 G @ 5 — 150 Hz
Altitude
15,000 ft (4,572 m)
50,000 ft (15,240 m)
†
See the cooling conditions outlined below for extended temperature specifications.
Airflow
600 LFM
400 LFM
200 LFM
100 LFM
0 LFM
Max. Ambient
450 – 500 MHz
65 °C
(149.0 °F)
64 °C
(147.2 °F)
53 °C
(127.4 °F)
44 °C
(111.2 °F)
Not
Recommended
Max. Ambient
550 – 600 MHz
55 °C
(131.0 °F)
54 °C
(129.2 °F)
43 °C
(109.4 °F)
34 °C
(93.2 °F)
Not
Recommended
Ambient temperature is measured at the leading edge of the CPU heatsink
with dual processors installed and all components fully populated.
A Note on Thermal Specifications
The technology and power density of the microprocessor is rapidly increasing. The 80386 required less than a few hundred
milliamps of current. The 80486DX4 peaked at less than 1.5 A and typically dissipated less than 5 W of power. The 233 MHz
Pentium
®
processor with MMX™ technology requires up to 6.5 A and dissipates as much as 17 W, while the Pentium II and later
processors continue this trend toward higher power levels.
RadiSys is continually working to ensure that its products will conform to thermal specifications. However, one peripheral device
installed within a chassis can significantly alter operating temperature, and software applications can cause as much as 20 °C
variation. Even the cable layout within the chassis can affect airflow and thereby performance.
RadiSys validates the operating specifications of its products by testing with the “hottest” available hardware and software
configuration to maximize the power supply draw and generate a worst-case scenario. Despite these efforts, the specifications
outlined above are only benchmarks and should be regarded as such.
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Summary of Contents for P3000BX2 Series
Page 14: ...Introduction 6 EPC 2322 SBC P3000 D BX2 Series Service Manual Notes S t o c k C h e c k c o m...
Page 62: ...Technical Data 54 EPC 2322 P3000 D BX2 Series Service Manual Notes S t o c k C h e c k c o m...
Page 64: ...Technical Data 56 EPC 2322 P3000 D BX2 Series Service Manual Notes S t o c k C h e c k c o m...
