15
RoHS Compliance Declarations
The raw materials of the product mentioned above are compliant with RoHS 2.0 regulations,
also known as Directive 2011/65/EU of the European Parliament and of the Council of 1
June 2011 on the restriction of the use of certain hazardous substances in electrical and
electronic equipment.
RoHS specifies maximum levels for cadmium (Cd), mercury (Hg), Hexavalent Chromium
(Cr VI), Polybrominated Biphenyls (PBBs), and Polybrominated Diphenyl Ethers (PBDEs)
on each homogeneous material in the product.
Cadmium (Cd) ≤ 100 ppm
Mercury (Hg) ≤ 1000 ppm
Hexavalent Chromium (Cr VI) ≤ 1000 ppm
Polybrominated Diphenyl Ethers (PBDEs) ≤ 1000 ppm
Polybrominated Biphenyls (PBBs) ≤ 1000 ppm
According to Exemption No. 7 from Directive 2011/65/EU for lead in telecommunications
equipment, applications exempted from the prohibition are shown below.
Lead in termination coatings of electrical and electronic components
Lead in solders on printed circuit boards
Lead in solders
The product is compliant with RoHS Directive 2011/65/EU and subsequent revised RoHS
directives (including Exemptions), as required below.
Lead in high melting temperature type solders (i.e. lead-based alloys containing 85%
by weight or more lead)
Lead in solders for servers, storage and storage array systems
Lead in solders for network infrastructure equipment for switching, signaling,
transmission as well as network management for telecommunications
Electrical and electronic components containing lead in a glass or ceramic other than
dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic
matrix compound
The maximum permitted concentrations in non-exempt homogenous materials are specified
as below.
Lead ≤ 1000 ppm
