Redpine Signals, Inc. Proprietary and Confidential
Page 29
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1.4
Circuit and Layout Guidelines
The following are guidelines for integrating the RS9113 module
with integrated antenna.
1.
The wireless module has 27 ground pads, with two different
sizes as mentioned below. Please note that all the ground pads
are aligned just across the center of the module on the bottom
side.
Please provide one ground pad of size 3.60mm x
3.60mm and 26 ground pads of size 1.4mm x 1.4 mm
copper pads on the top side of the application board.
Please open the solder mask in this area so that the
Cu is exposed
Please provide one ground pad of size 3.60mm x
3.60mm or higher copper pad on the bottom side of
the application board. Please open the solder mask in
this area so that the Cu is exposed.
The RF ground pad should have 16 Vias, Each via
should have a pad size of 24mil diameter and a 16mil
drill.
2.
For RESET, one of the following three options should be followed.
a.
Reset may be driven by an R-C circuit. The recommended
value of ‘R’ is 100 K
Ω
and the recommended value of ‘C’ is
0.1uF.
b.
Reset may be driven IC based circuit.
c.
The RESET can be Host driven. At the time of Power-on,
Please ensure that the reset is held low for 20mSec or
more. After this the reset should be driven high.
3.
The copper underneath the antenna on the application board
should be etched out on all the layers.
Figure 9: Copper Etching Guidelines
