EFR32BG22
Shenzhen RF-star Technology Co., Ltd.
Page 86 of 93
3.
The signal attenuation will be very obvious if there is metal near the antenna or if the module is placed inside the
metal shell.
4.
The incorrect power register set or the high data rate in open air may shorten the communication distance. The
higher the data rate, the closer the distance.
5.
The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6.
The unmatchable antennas and modules or the poor quality of the antenna will affect the communication distance.
9.5.2 Vulnerable Module
1.
Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuating
voltage.
2.
Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3.
Due to some humidity-sensitive components, please ensure suitable humidity during installation and application. If
there is no special demand, it is not recommended to use at too high or too low temperature.
9.5.3 High Bit Error Rate
1.
There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2.
The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply's reliability.
3.
If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
9.6 Electrostatics Discharge Warnings
The module will be damaged by the discharge of static. RF-star suggests that all modules should follow the 3 precautions
below:
1.
According to the anti-static measures, bare hands are not allowed to touch modules.
2.
Modules must be placed in anti-static areas.
3.
Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of the module, even causing the failure.
9.7 Soldering and Reflow Condition
1.
Heating method: Conventional Convection or IR/convection.
2.
Solder paste composition: Sn96.5 / Ag3.0 / Cu0.5
3.
Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
Summary of Contents for EFR32BG22
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