RF-BM-S02
Shenzhen RF-star Technology Co., Ltd.
Page 17 of 23
4.7 Soldering and Reflow Condition
1.
Heating method: Conventional Convection or IR/convection.
2.
Solder paste composition: Sn96.5 / Ag3.0 / Cu0.5
3.
Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4.
Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5.
Peak temperature: 245
℃
.
Table 7. Temperature Table of Soldering and Reflow
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63 / Pb37
Sn96.5 / Ag3.0 / Cu0.5
Min. Preheating Temperature (T
min
)
100
℃
150
℃
Max. Preheating Temperature (T
max
)
150
℃
200
℃
Preheating Time (T
min
to T
max
) (t
1
)
60 s ~ 120 s
60 s ~ 120 s
Average Ascend Rate (T
max
to T
p
)
Max. 3
℃
/s
Max. 3
℃
/s
Liquid Temperature (T
L
)
183
℃
217
℃
Time above Liquidus (t
L
)
60 s ~ 90 s
30 s ~ 90 s
Peak Temperature (T
p
)
220
℃
~ 235
℃
230
℃
~ 250
℃
Average Descend Rate (T
p
to T
max
)
Max. 6
℃
/s
Max. 6
℃
/s
Time from 25
℃
to Peak Temperature (t
2
)
Max. 6 minutes
Max. 8 minutes
Time of Soldering Zone (t
P
)
20
±10 s
20
±10 s
Figure 8. Recommended Reflow for Lead Free Solder
