3 Device description
EN
8
Rittal Liquid Cooling Package
3
Device description
3.1
General functional description
The Liquid Cooling Package is essentially an air/water
heat exchanger that is used to dissipate high heat
losses from server enclosures or for the effective cool-
ing of devices built into a server enclosure.
The air routing in the Liquid Cooling Package sup-
ports the "front to back" cooling principle of the devic-
es built into the server enclosure. The hot air expelled
by the devices in the server enclosure is drawn in by
the fans at the rear directly from the server enclosure
(LCP Rack) or from the hot aisle (LCP Inline and LCP
Inline flush) and thus routed through the heat ex-
changer module.
In the heat exchanger module, the heated air is direct-
ed through an air/water heat exchanger, and its ther-
mal energy (heat losses from the server) is transferred
to a cold water system. As a result, the air is cooled to
a freely selectable temperature within the authorised
parameters and then routed directly in front of the
482.6 mm (19") level in the server enclosure (LCP
Rack) or into the cold aisle (LCP Inline and LCP Inline
flush).
In its delivered state, the LCP Inline expels the cold air
on both sides. By fitting a side panel or partition, this
can be restricted to one side only.
Fig. 1:
Air routing on the LCP Rack – top view
Key
1
Air inlet
2
Heat exchanger
3
Air outlet
4
Fan module
5
2nd air inlet
6
2nd air outlet
Fig. 2:
Air routing on the LCP Rack – top view
Key
1
Air inlet
2
Heat exchanger
3
Air outlet
4
Fan module
Fig. 3:
Air routing on the LCP Inline flush – top view
Key
1
Air inlet
2
Heat exchanger
3
Fan module
4
Air outlet
2
1
5
6
3
4
2
1
3
3
4
2
1
3
4