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Rockwell Automation Publication 1794-UM061B-EN-P - March 2020
Preface
WARNING:
When you insert or remove the module while backplane power
is on, an electrical arc can occur. This could cause an explosion in hazardous
location installations. Be sure that power is removed or the area is
nonhazardous before proceeding.
ATTENTION:
FLEX I/O is grounded through the DIN rail to chassis ground.
Use zinc-plated yellow-chromate steel DIN rail to assure proper grounding.
The use of other DIN rail materials (such as aluminum or plastic) that can
corrode, oxidize, or are poor conductors, can result in improper or
intermittent grounding.
ATTENTION: Prevent Electrostatic Discharge
This equipment is sensitive to electrostatic discharge, which can cause
internal damage and affect normal operation. Follow these guidelines when
you handle this equipment:
• Touch a grounded object to discharge potential static.
• Wear an approved grounding wriststrap.
• Do not touch connectors or pins on component boards.
• Do not touch circuit components inside the equipment.
• If available, use a static-safe workstation.
ATTENTION:
During mounting of all devices, be sure that all debris (such as
metal chips or wire strands) is kept from falling into the module. Debris that
falls into the module could cause damage on power-up.
