samsung.com/semi/dram
8
1H 2011
DDR2, DDR & SDRAM Components
SdrAM coMPonentS
Density
Organization
Part Number
# Pins - Package
Speed (Mbps)
Refresh
256Mb
64Mx4
K4s560432N-LC(L)75000
54-tsoP
133
8K
32Mx8
K4s560832N-LC(L)75000
54-tsoP
133
8K
16Mx16
K4s561632N-LC(L)(75/60)000
54-tsoP
133/166
8K
128Mb
16Mx8
K4s280832o-LC(L)75000
54-tsoP
133
4K
8Mx16
K4s281632o-LC(L)(75/60)000
54-tsoP
133/166
4K
Notes:
L = Commercial temp., Low Power
For Industrial temperature, check with ssI Marketing
Banks: 4
All products are Lead Free
Voltage: 3.3V
speed: PC133 (133MHz CL=3/PC100 CL2)
ddr SdrAM coMPonentS
Density
Organization
Part Number
# Pins - Package
Speed (Mbps)
512Mb
128Mx4
K4H510438J-LCB3/B0
66-tsoP
266/333
K4H510438J-HCCC/B3
60-FBGA
333/400
64Mx8
K4H510838J-LCCC/B3
66-tsoP
333/400
K4H510838J-HCCC/B3
60-FBGA
333/400
32Mx16
K4H511638J-LCCC/B3
66-tsoP
333/400
256Mb
64Mx4
K4H560438N-LCB3/B0
66-tsoP
266/333
32Mx8
K4H560838N-LCCC/B3
66-tsoP
333/400
16Mx16
K4H561638N-LCCC/B3
66-tsoP
333/400
128Mb
8Mx16
K4H281638o-LCCC
66-tsoP
400
Notes:
B0 = DDR266 (133MHz @ CL=2.5)
A2 = DDR266 (133MHz @ Cl=2)
B3 = DDR333 (166MHz @ CL=2.5) CC = DDR400 (200MHz @ CL=3)
ddr2 SdrAM unBuFFered ModuleS (ecc)
Density
Organization
Part Number
Composition
Compliance
Speed (Mbps)
Rank
Production
1GB
128Mx72
M391t2863FB3-C(e6/F7)
(128Mx8)*9
Lead free
667/800
1
Now
2GB
256Mx64
M391t5663FB3-C(e6/F7)
(128Mx8)*18
Lead free
667/800
2
Now
Notes:
e6 = PC2-5300 (DDR2-667 @ CL=5)
e7 = PC2-6400 (DDR2-800 @ CL=5)
F7 = PC2-6400 (DDR2-800 @ CL=6)
Voltage = 1.8V
ddr2 SdrAM SodiMM ModuleS
Density
Organization
Part Number
Composition
Compliance
Speed (Mbps)
Rank
Production
1GB
128Mx64
M470t2863FB3-C(e6/F7/e7)
(64Mx16)*8
Lead free
667/800
2
Now
2GB
256Mx64
M470t5663FB3-C(e6/F7/e7)
(128M x8)*8
Lead free
667/800
2
Now
Notes:
e6 = PC2-5300 (DDR2-667 @ CL=5)
e7 = PC2-6400 (DDR2-800 @ CL=5)
F7 = PC2-6400 (DDR2-800 @ CL=6)
Voltage = 1.8V
ddr2 SdrAM coMPonentS
Density
Organization
Part Number
# Pins-Package Dimensions
Package
Speed (Mbps)
Production
256Mb
16Mx16
K4t56163QN-HC(e6/F7/e7/F8)
84-FBGA
7.5x12.5mm
Lead free & Halogen free
667/800/1066
Now
512Mb
128M x4
K4t51043QI-HC(e6/F7/e7)
60-FBGA
7.5x9.5mm
Lead free & Halogen free
667/800
Now
64M x8
K4t51083QI-HC(e6/F7/e7/F8)
60-FBGA
7.5x9.5mm
Lead free & Halogen free
667/800/1066
Now
32M x16
K4t51163QI-HC(e6/F7/e7/F8)
84-FBGA
7.5x12.5mm
Lead free & Halogen free
667/800/1066
Now
128M x4
K4t51043QJ-HC(e6/F7/e7)
60-FBGA
7.5x9.5mm
Lead free & Halogen free
667/800
Q3
64M x8
K4t51083QJ-HC(e6/F7/e7/F8)
60-FBGA
7.5x9.5mm
Lead free & Halogen free
667/800/1066
Q3
32M x16
K4t51163QJ-HC(e6/F7/e7/F8)
84-FBGA
7.5x12.5mm
Lead free & Halogen free
667/800/1066
Q3
1Gb
256M x4
K4t1G044QF-BC(e6/F7/e7)
60-FBGA
7.5x9.5mm
Lead free & Halogen free
667/800
Now
128M x8
K4t1G084QF-BC(e6/F7/e7/F8)
60-FBGA
7.5x9.5mm
Lead free & Halogen free
667/800/1066
Now
64M x16
K4t1G164QF-BC(e6/F7/e7/F8)
84-FBGA
7.5x12.5mm
Lead free & Halogen free
667/800/1066
Now
Notes:
e6 = DDR2-667 (5-5-5)
F7 = DDR2-800 (6-6-6)
e7 = DDR2-800 (5-5-5)
F8 = DDR2-1066 (7-7-7)
Voltage = 1.8V
Package Type
H = FBGA (Lead-free & Halogen-free)
B = FBGA (Lead-free & Halogen-free, Flip Chip)
ddr2 SdrAM unBuFFered ModuleS
Density
Organization
Part Number
Composition
Compliance
Speed (Mbps)
Rank
Production
1GB
128Mx64
M378t2863FBs-C(e6/F7/e7)
(128M x8)*8
Lead free
667/800
1
Now
2GB
256Mx64
M378t5663FB3-C(e6/F7/e7)
(128M x8)*16
Lead free
667/800
2
Now
Notes:
e6 = PC2-5300 (DDR2-667 @ CL=5)
e7 = PC2-6400 (DDR2-800 @ CL=5)
F7 = PC2-6400 (DDR2-800 @ CL=6)
Voltage = 1.8V
