2. Product specification and description
2.2.5.1. Main board
Chorus3–Next(C3N) chip is adopted as the main processor. Its process speed is 533 MHz. It is integrated engine controller,
video controller, scan controller.
DDR3 128MB is adopted for high speed data processing. Boot adopted the 16MB SPI + 4MB SPI.
USB is the embedded type and wired network supports 100M full duplex.
[Main board diagram]
M
a in Bo a rd
B
lo c k Dia g ra m o f
CLX-330x s e rie s
C
HOR US3-N
A
R M11
ÞÞ
533
M
Hz
R
AM
c ontrolle r
G
P IO
M
A
C
U
AR
T
I
2C
S
te p
M
otor
I
ma ge
P roc e s s or
L
oc a l
c ontrolle r
U
S B
2.0
A
DC
8 C H
P
W
M
6C H
L
S U
controller
H
P VC
P
LL
E
EP
R
O
M
8/32K/64 KB
N
a nd
Fla s h
1
28
M
B
S
S CG
SD
A
SCL
D
D
R
3
1
28
M
B
A
4984
USB
Clo ck
Vclk
Mclk
12 MHz
CONT
R
OL
C
R
U
M
Y
C
R
U
M M
C
R
U
M
C
C
R
U
M
K
C
R
U
M
J oint
&
Oute r
TE
M
P
HU
M
IDIDY
4p
4p
4p
4p
6p
L
S U
P
olygon
M
otor
L
D
B
ãã
d
5p
9p
16p
4p
S
c a n
motor
U
S B
HOS T
DI
R
EC T
U
S B
DEVIC E
4p
5p
T
2
c lutc h
3p
L
A
N
14p
W,FN,FW mo d e l o n ly
M
ODE
M
S
pe a ke r
A
DF
I/F
A
DF
M
otor
A
DF
S e ns or
4in1 On ly
C
onne ction
I/F
Boa rd
2
4p
12p
30p
SPI
11p
W
-L
A
N
M
odule
Wire le s s Mo d e l
o n ly
C
IS
16p
10p
B
LDC
M
otor
(
MA
IN)
O
P E
P
A
NEL
LCD
/
M
ICO
M
/
Ba tte ry
9p
S
C
A
N
Home
s e ns or
3p
O
utbin
full
s e ns or
3p
W
a s te
Tone r
TX
&
R
X
H
VP S
T
1
T2
CH
AR
GE
R
De ve
S upply
De ve
Bia s
De ve
Dr.Bla de
27p
4p
F
A
N
2p
F
ront
Cove r
ope n
2p
00000000000000000000000
00000000000000000000000
00000000000000000000000
00000000000000000000000
00000000000000000000000
00000000000000000000000
NC
E
XIT
s e ns or
3p
P
TL
L
AM
P
2p
R
e a r
Cove r
ope n
2p
S
M
P S
+
24 V
/
+5V
C
ontrol
S igna l
F
us e r
A
C
14p
F
US E
R
L
AM
P
T
he rmis tor
2p
2p
R
e gi
c lutc h
2p
I
TB
c lutc h
D
EVE
c lutc h
D
EVE
HO
M
E
s e ns or
2p
3p
2p
E
mpty
s e ns or
R
e gi
s e ns or
6p
3p
3p
P
ic kup
c lutc h
2p
I
TB
HO
M
E
s e ns or
&
Inne r
TE
M
P .
5
p
C
TD
5p
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-24