Samsung
Confidential
L
R
L
R
4
DATE
A
CHECK
REV
TITLE
PART NO.
THIS DOCUMENT CONTAINS CONFIDENTIAL
SAMSUNG ELECTRONICS CO’S PROPERTY.
MODULE CODE
HP depop circuit
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
COM-22C-015(1996.6.5) REV. 3
APPROVAL
DRAW
Connect to Mount-hole.
4
B
OF
HEADPHONE
A
C
Internal MIC
LAST EDIT
B
SAMSUNG
3
1
NO_STUFF
SUN XIAO
WUSHIJIANG
KEVIN LEE
6/26/2007
PV2
1.0
October 23, 2007 10:38:02 AM
BA41-XXXXX
40
58
Gevena
HEAD PHONE JACK
AND MIC JACK
D:/tingting/geneva/Geneva_pr_1023
2
DEV. STEP
The traces led to Audio Jacks have the width over 10mil
PAGE
3
C
SAMSUNG PROPRIETARY
D
ELECTRONICS
D
2
EXCEPT AS AUTHORIZED BY SAMSUNG.
PROPRIETARY INFORMATION THAT IS
MIC JACK
1
56
R138
AS
100uF
EC26
16V
1%
20K
R137
3
2
BLM18PG181SN1
B533
5
6
G1
G2
G_AUD
Q20
MMBT3904
1
G_AUD
P3.3V
JACK-PHONE-6P-PINK
J13
1
2
3
4
U519-1
LMV358M
+
3
2
-
4
G
OUT
1
V
8
GND2
B26
BLM18PG181SN1
C819
2.2nF
R702
4.7K
R703
0
6.3V
C818
1000nF
GND2
VDD_AUD
GND2
NO_STUFF
C766
1nF
EC25
100uF
16V
AS
G_AUD
JACK-PHONE-6P-LIME
J12
1
2
3
4
5
6
G1
G2
2K
R699
1%
TP19248
S
2
R700
47K
GND2
Q19
RHU002N06
3
D
G
1
C817
1000nF
6.3V
40-C2
43-C1
1%
1K
R124
3
2
R122
56
DTA114YUA
Q21
1
C149
0.1nF
NO_STUFF
C767
1nF
R796
330
40-C4
1%
1nF
C768
1%
R139
10K
B534
BLM18PG181SN1
40-C2
GND2
1K
R701
1%
U519-2
LMV358M
+
5
6
-
4
G
OUT
7
V
8
VDD_AUD
R121
20K
1%
G_AUD
0.1nF
C150
J502
HDR-2P-SMD
1
2
B529
BLM18PG181SN1
C816
0.1nF
MMBT3904
Q18
1
3
2
40-C2
TP19247
40-C2
1nF
C151
330
R797
1%
R248
40-B1
BLM18PG181SN1
B27
NO_STUFF
3.3K
R123
1K 1%
1%
1000nF
C893
6.3V
1%
20K
R740
KBC3_SPKMUTE
AUD5_SENS_MIC#
VDD_AUD
20K
R739
AUD5_HP_O_L
AUD5_HP_O_R
AUD5_MIC1_R
AUD5_MIC1_L
AUD5_MIC_VREF
AUD5_INTMIC
AUD5_SENS_HP#
AUD3_GPIO1#
