5-7
Samsung Electronics
Exploded View & Part List
This Document can not be used without Samsung’s authorization.
Loc. No.
Part No.
Description
Specification
Qty. SNA Remark
WC31
2305-000407 C-FILM,LEAD-PEF
470nF,5%,100V,TP,10.5x6x
2
SA
X202
2801-004371 CRYSTAL-SMD
12.288MHz,50ppm,SX-1,18pF,50
1
SNA
XT01
0201-001578 ADHESIVE-HM
HM-555,WHT,4,000 Cps
0.5
SNA
X-TAL1
2801-001394 CRYSTAL-UNIT
.032768MHz,20ppm,28-AAY,12.
1
SNA
ZC14
2203-000626 C-CER,CHIP
0.022nF,5%,50V,C0G,1608
4
SNA
ZC35
2203-000681 C-CER,CHIP
0.027nF,5%,50V,C0G,1608
2
SA
ZIC3
1107-001709 IC-FLASH MEMORY
MX25L1605DM2I-12G,16Mbit
1
SNA
ZPR3
2007-000106 R-CHIP
220Kohm,5%,1/10W,TP,1608
1
SA
ZR10
2007-001164 R-CHIP
75ohm,1%,1/10W,TP,1608
4
SA
ZR24
2007-000109 R-CHIP
1Mohm,5%,1/10W,TP,1608
3
SA
ZR45
2007-000329 R-CHIP
11Kohm,5%,1/10W,TP,1608
1
SA
ZRN10
2011-001261 R-NETWORK
33ohm,5%,1/16W,L,CHIP,8P,TP,2.
7
SA
ZVL3
3301-001495 BEAD-SMD
120ohm,2012,2500mA,TP,115ohm/10
2
SA
ZVR8
2007-000824 R-CHIP
390ohm,5%,1/4W,TP,3216
9
SA
0202-001463 SOLDER-WIRE
LFC2-W3.0,-,D3,99.79Sn/0.2Cu
4.215 SNA
0202-001477 SOLDER-CREAM
LST309-M,D20~45um,96.5Sn/3A
1.57 SNA
0202-001608 SOLDER-WIRE FLUX
LFC7-107,D0.8,99.3Sn/0.
0.025 SNA
0204-002420 SOLVENT
1M-1000,C3H70H,96
4.83 SNA
0204-002607 FLUX
DF-234U,13%,14KG,Gravity 0.82
5.616 SNA
0205-001154 OIL-SILICON
G746
0.4
SNA
0205-001154 OIL-SILICON
G746
0.2
SNA
0403-001164 DIODE-ZENER
MMSZ5232B,5.32-5.88V,500MW,S
2
SA
0406-001128 DIODE-TVS
MLVS-0603-E08,50V
1
SA
0501-000150 TR-SMALL SIGNAL
2SA1037,PNP,200mW,SOT-23
1
SA
0505-002582 FET-SILICON
IRFI4019HG-117P,N,150,8.7,0.
2
SA
1003-002268 IC-GATE DRIVER
IRS2053MTRPBF,MLPQ,48P,7X
1
SA
1204-002968 IC-MODULATOR
PS9830B,TQFP,100P,14x14mm,P
1
SA
1204-003124 IC-PAL/NTSC DECODER
ES8396SCD,LQFP,216P,
1
SA
2007-000253 R-CHIP
1.5ohm,5%,1/4W,TP,3216
2
SA
2007-000504 R-CHIP
2.2ohm,5%,1/4W,TP,3216
2
SA
2007-007065 R-CHIP
10ohm,5%,1W,TP,6432
5
SA
2007-007625 R-CHIP
0ohm,5%,1W,TP,6432
4
SA
2011-001345 R-NETWORK
10Kohm,5%,1/16W,L,CHIP,8P,TP,2
1
SA
2301-001760 C-FILM,MPEF
100nF,10%,250V,TP,B5xH13.5x1
2
SA
AH41-01287B PCB MAIN
MX-C750,FR-4,2,T1.6,197*235,PCB
1
SNA
AH62-00227A HEAT SINK-MAIN2
MAX-DC630,AL,10,45,80,MA
1
SNA
AH62-00231A HEAT SINK-ASSY
MAX-DC630,al,2,32,83,wht,
1
SNA
AH95-00015A ASSY SUB PCB-HEAT SINK
MX-C730
1
SNA
AH97-04821A ASSY AUTO
MAIN PCB ASSY,MX-C730/SMT,CD,M
1
SNA
AH97-05134A ASSY SMD
MX-C730/XAP,CD,MIC,FM ONLY,2,AH
1
SNA
AH97-05313B ASSY MICOM-MICOM IC
HMC730WWM-1005.0,201
1
SNA
AH97-05313F ASSY MICOM-NOR FLASH
HMC-C730WWB-1005.0,
1
SNA
AH91-00178A ASSY SPEAKER
MX-C730/XAO-XAP
1
SNA
SP01A
AH96-00217D ASSY SPEAKER P
4 OHM,2.0CH,PS-C730 SPK S
1
SNA
ASP02
AH81-05679A SPEAKER-SYSTEM
PS-C630,SPEAKER SYSTEM
2
SA
F001
AH64-05255A PANEL FRONT
PS-C630,ABS
4
SNA
AH64-05256A DECORATION
PS-C530,ABS
4
SNA
Summary of Contents for MAX-G55
Page 24: ...3 12 Samsung Electronics MEMO ...
Page 44: ...5 11 Samsung Electronics MEMO ...
Page 55: ...5 11 Samsung Electronics MEMO ...
Page 57: ...6 2 Samsung Electronics PCB Diagram 6 2 FRONT PCB Top 1 UCW2 USJ1 UCW1 UIC2 ...
Page 59: ...6 4 Samsung Electronics PCB Diagram 6 3 FRONT PCB Bottom FIC1 UIC2 UCW1 USJ1 UCW2 ...
Page 64: ...Samsung Electronics 6 9 PCB Diagram 6 6 SMPS PCB Top CON2 CN1 UB1 CON3 UM1 ...
Page 65: ...6 10 Samsung Electronics PCB Diagram 6 7 SMPS PCB Bottom CON2 CN1 UB1 CON3 UM1 ...
Page 73: ...7 8 Samsung Electronics MEMO ...