8-77
R530/R730
8. Block Diagram and Schematic
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Confidential
Samsung
Confidential
Samsung
Confidential
Interrupt I/F
PCI - Expres
s
SP
I
2/
5
PCI
B
SPI
3
PAGE
LPC option ; These are used with LP
C
DAT
E
PCI3_GNT0#
B
4
THIS DOCUMENT CONTAINS CONFIDENTIA
L
1
MODULE CODE
ELECTRONICS
HIGH
HIGH
PROPRIETARY INFORMATION THAT IS
LPC
OF
LOW
APPROVAL
EXCEPT AS AUTHORIZED BY SAMSUNG
.
D
Boot BIOS Selec
t
PART NO
.
Resistor for Test : Place Stuffing Option to minimize stubs
iTPM Disabl
e
SAMSUNG ELECTRONICS CO’S PROPERTY.
D
HIGH
DEV. STEP
RE
V
AC caps : PCIE need to be within 250mils of the driver
4
SAMSUNG PROPRIETAR
Y
ADV2nd
1.0
October 05, 2009 20:00:56 PM
BA41-xxxxxA
21
Bremen-UL
ICH_9M_B
ICH9-M (2/5)
D:/users/mobile29/mentor/Bremen-UL/Bremen-UL_Et
c
BIOS
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHER
S
LAST EDIT
CHECK
2
A
TITLE
HIGH
C
To protect ESD
3
A
2
SPI3_CS1#
LOW
SAMSUNG
C
PCI
DRA
W
1
50
V
TW.Kim
HJ.Kim
SJ.Park
undefined
9/23/2008
nostuff
C754
0.1n
F
R667
10K
10
K
R
74
1
10
K
R
17
9
10
K
R
74
3
R
18
0
10
K
10
K
R738
10K
R744
1%
P3.3V
R772
10
K
100K
R693
SMT1
0-1005
SPI_CS0#
F23
SPI_CS1#_GPIO58_CLGPIO
6
E23
SPI_MISO
D2
5
SPI_MOS
I
A4
STOP#
F5
TR
D
Y#
PIRQG#_GPIO
4
PIRQH#_GPIO
5
G2
C2
PLOCK#
C14
PLTRST
#
R2
PME#
F1
REQ0
#
B6
REQ1#_GPI050
F1
3
REQ2#_GPIO52
E6
REQ3#_GPIO54
J4
SERR#
D2
3
SPI_CL
K
D2
4
K26
PETP
3
PETP
4
H2
6
F26
PETP
5
D2
6
PETP6_GLAN_TX
P
J5
PIRQA#
E1
PIRQB#
J6
PIRQC#
C4
PIRQD#
H4
PIRQE#_GPIO2
K6
PIRQF#_GPIO
3
F2
PERP
5
C2
8
PERP6_GLAN_RXP
E4
PERR#
P2
7
PETN
1
PETN
2
M2
7
PETN
3
K27
PETN
4
H2
7
F27
PETN
5
D2
7
PETN6_GLAN_TX
N
PETP
1
P26
PETP
2
M2
6
PCIRST
#
PERN
1
N2
9
PERN
2
L29
PERN
3
J2
9
PERN
4
G2
9
E2
9
PERN
5
C2
9
PERN6_GLAN_RX
N
PERP
1
N2
8
PERP
2
L28
PERP
3
J28
PERP
4
G2
8
E2
8
C_BE3
#
A5
C6
DEVSEL
#
D7
FRAME#
G4
GNT0
#
A7
GNT1#_GPIO51
F1
2
GNT2#_GPIO53
F6
GNT3#_GPIO55
D3
IRDY
#
PAR
E3
D4
PCICLK
R1
G1
A
D
31
H3
AD4
E9
AD5
C9
E1
0
AD6
AD7
B7
AD8
C7
AD9
C5
D8
C_BE0
#
B4
C_BE1
#
D6
C_BE2
#
AD2
1
C3
AD2
2
F3
F4
AD2
3
AD2
4
C1
G7
AD2
5
AD2
6
H7
A
D
27
D1
A
D
28
G5
A
D
29
H6
AD3
E1
2
A
D
30
F8
AD1
1
AD1
2
F1
1
AD1
3
E7
AD1
4
A3
AD1
5
D2
AD1
6
F1
0
AD1
7
D5
AD1
8
D10
AD1
9
B3
D9
AD2
AD2
0
F7
U10-
2
NH82801IBM
D11
AD0
AD1
C8
AD1
0
G11
10
K
R
74
5
0904-002378
1%
R669
1K
1%
R
74
2
nostuf
f
R677
12.1
1K
10
K
R
17
7
1%
10K
R771
P3.3V
C717
10V
100nF
R178
10K
1%
R671
12.1
10
K
R
17
5
C734
100n
F
10V
10
K
R
17
6
10
K
R171
C718
100nF
12.1
R676
1%
10V
P3.3V
P3.3V
10K
R770
100nF
C735
10V
P3.3V
PCI3_EDVSEL#_MN
PCI3_PCLK#_MN
PCI3_FRAME#_M
N
PCI3_STOP#_MN
SPI3_CLK_R_M
N
SPI3_MOSI_R_M
N
PLT3_RST#
CHP3_PIRGB#_M
N
CHP3_PIRGD#_MN
CHP3_PIRGA#_M
N
CHP3_PIRGC#_MN
PEX1_MINITXP1_C_M
N
PEX1_MINITXN1_C_M
N
PEX1_GLAN_TXP4_C_MN PEX1_GLAN_TXN4__C_M
N
PCI3_REQ0#_MN
PCI3_GNT0#_MN
PCI3_IRDY#_MN
CHP3_SERIR
Q
PCI3_CLKRUN
#
PEX1_MINITXP1 PEX1_MINITXN1 PEX1_MINIRXP1 PEX1_MINIRXN1
CLK3_PCLKICH
PCI3_PERR#_M
N
HST3_SPI3_D
O
PEX1_LAN_TXP4 PEX1_LAN_TXN4 PEX1_LAN_RXP4 PEX1_LAN_RXN4
PCI3_SERR#_M
N
PCI3_TRDY#_M
N
HST3_SPI3_D
I
SPI3_CS0#_R_M
N
HST3_SPI3_CS# HST3_SPI3_CLK
Summary of Contents for R530
Page 5: ...iii Contents This Document can not be used without Samsung s authorization R530 R730...
Page 64: ...6 40 6 Material List This Document can not be used without Samsung s authorization R530 R730...
Page 240: ...4 23 4 Troubleshooting This Document can not be used without Samsung s authorization R530 R730...
Page 241: ...4 24 4 Troubleshooting This Document can not be used without Samsung s authorization R530 R730...
Page 249: ...4 32 4 Troubleshooting This Document can not be used without Samsung s authorization R530 R730...
