Reference Information
Samsung Electronics
14-33
4) FIFO
Core has an Endpoint 0 FIFO that handles the standard descriptor and the class specific descriptor.
And that FIFO is connected to a microcontroller decode block.
The user can define the size of FIFO.
Except EPO FIFO, only FIFOs that have configurable direction control can support the unidirectional operation
through a certain configuration. The maximum packet size for the In and Out tokens are set up through the
register. All In/Out FIFOs are connected to the microcontroller decode block.
5) Microcontroller Decode Block
This block is composed of the internal register decoding block and the microcontroller interface block.
This microcontroller interface has addresses and data bus interfaces that are either synchronous or
asynchronous.
This core improves the performance by reducing the microcontroller's burden via a data buffering.
6) Internet Register
Using of the indexing scheme by the internal register for the endpoint register is as follows:
- IN_CSR (IN Control Status Register)
- OUT_CSR (OUT Control Status Register)
- IN_MAXP (IN Maximum Packet Size Register)
- OUT WRITE COUNT
If the core does not include any OUT endpoint, OUT_CSR does not exist. However, OUT WRITE COUNT
register exists to read WRITE, the count for the endpoint 0.
Interrupt (Status) and Interrupt Enable register are divided into two banks.
- Endpoint Interrupts
- USB Interrupts
If there is no endpoint that is larger than endpoint #8, ENDPOINT INTERRUP2 register and ENDPOINT
INTERRUPT ENABLE register do not exist.
MAXP, ENDPOINT INTERRUPT, END POINT INTERRUPT ENABLE registers are used regardless of the
direction of endpoints. For example, if an endpoint that has an OUT direction is chosen by the INDEX register,
ENDPOINT INTERRUPT register would provide an endpoint along with the OUT interrupt information.
On the other hand, the CSR register that is connected for each endpoint must be indexed, and can be different
according the certain endpoint direction.
Summary of Contents for VP-D371
Page 12: ...Product Specification 2 4 Samsung Electronics MEMO ...
Page 46: ...4 18 Disassembly and Reassembly Samsung Electronics MEMO ...
Page 66: ...Exploded View and Parts List 5 20 Samsung Electronics MEMO ...
Page 83: ...Samsung Electronics 8 1 8 Wiring Diagram ...
Page 84: ...Wiring Diagram 8 2 Samsung Electronics MEMO ...
Page 93: ...PCB Diagrams Samsung Electronics 9 9 9 10 CVF PCB COMPONENT SIDE CONDUCTOR SIDE ...
Page 94: ...PCB Diagrams 9 10 Samsung Electronics MEMO ...
Page 118: ...Schematic Diagrams 10 24 Samsung Electronics MEMO ...
Page 119: ...Samsung Electronics 11 1 11 Operating Instructions ...
Page 120: ...Operating Instructions 11 2 Samsung Electronics ...
Page 121: ...Operating Instructions 11 3 Samsung Electronics ...
Page 122: ...Operating Instructions 11 4 Samsung Electronics ...
Page 123: ...Operating Instructions 11 5 Samsung Electronics ...
Page 124: ...Operating Instructions 11 6 Samsung Electronics ...
Page 125: ...Operating Instructions 11 7 Samsung Electronics ...
Page 126: ...Operating Instructions 11 8 Samsung Electronics ...
Page 127: ...Operating Instructions 11 9 Samsung Electronics ...
Page 128: ...Operating Instructions 11 10 Samsung Electronics ...
Page 129: ...Operating Instructions 11 11 Samsung Electronics ...
Page 130: ...Operating Instructions 11 12 Samsung Electronics ...
Page 131: ...Operating Instructions 11 13 Samsung Electronics ...
Page 132: ...Operating Instructions 11 14 Samsung Electronics ...
Page 133: ...Operating Instructions 11 15 Samsung Electronics ...
Page 134: ...Operating Instructions 11 16 Samsung Electronics ...
Page 135: ...Operating Instructions 11 17 Samsung Electronics ...
Page 136: ...Operating Instructions 11 18 Samsung Electronics MEMO ...
Page 148: ...Troubleshooting 12 12 Samsung Electronics MEMO ...
Page 168: ...Circuit Operating Description 13 20 Samsung Electronics MEMO ...
Page 183: ...Reference Information Samsung Electronics 14 15 Fig 14 14 ...
Page 212: ...Reference Information 14 44 Samsung Electronics 14 5 Abbreviated word ...