COMe-cEL6 - User Guide, Rev.1.3
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2.3.
Functional Specification
2.3.1.
Block Diagram
Figure 3: Block Diagram COMe-cEL6
2nd
SPI
BIOS Flash
2x
CAN
GP
SPI
RSVD
PCIe #5
USB #7
(OTG)
eDP
SGMII
DDR4 3200 MT/s
SODIMM
USBSS #0
(USB 3.0)
LVDS
PwrCtrl
SysMgmt
SDIO
eSPI
SPI
DP++
DDI2
DP++
DDI1
PCIe #0-4
LAN
SATA0
SATA1
HDA
eMMC
Intel Atom® x6000E,
Pentium® and
Celeron® Series
Connector
Option
Standard
component
eMMC
VCC
5
VSB
HWM
COM Express® connector CD – Pin-out Type 6
DDR4 3200 MT/s
SODIMM
Intel
GPY115
(GPY215)
microSD
Socket
PWM
FAN1
I2C
SMB
LID
Sleep
LVDS
GPIO
Embedded Controller
HWM
CPU FAN0
Power sequencing
Watchdog
eSPI2I2C
I2C
EEPROM
Gen11
iGFX
SPI
BIOS Flash
GPIO
Ctrl
Mgmt
GPIO Buffer
eDP2LVDS
COM Express® connector AB – Pin-out Type 6
USB #0-7
(USB 2.0)
USB 3.1
(HSIO: #0,1)
USB 2.0
(Host)
TPM 2.0
SATA
(HSIO #10,11)
TPM
USBSS #1-3
(USB 3.0)
USB Hub
USBSS #1
(USB 3.0)
LAN
(HSIO #7)
PCIe
#0-4
(HSIO: #2-6
SATA
alternatively
conf. as
GbE
GbE
Misc
Signals
LPC
(eSPI)
2x
UART
PCIe
#5
(HSIO: #8)
VBAT
USB 2.0
OTG
SER0
SER1
2.3.2.
Processors
The COMe-cEL6 is based on the
Intel® series of Multi Chip Package (MCP) Atom™ X6000E series, Pentium® and
Celeron® processors, with a Platform Controller Hub (PCH) on the same package
(compact Type 3 BGA 35 mm x
24 mm package).
The processor variants support the following technologies:
Intel® 64 Architecture
Intel® Gen 11 GFX graphics
Intel® Programmable Service Engine (PSE)
Intel® Virtualization Technology (VT-2/VT-x) with extended pages and (VT-d) for directed I/O
Real time computing with Intel Time Coordinated Computing (TCC)
Thermal Management with Intel® Thermal Monitor (TM1 and TM2)
Power Management with Intel® Speed Shift Technology
Security with Intel® Boot Guard device protection, Secure Key and Intel® AES NI
