COMe-mEL10 - User Guide Rev. 1.1
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2.3.14.
Features
T
he following table lists General, Special and Optional COMe-mEL10 features.
General Features
SPI
On-module and external carrier boot from SPI
LPC
LPC bus (default) pins shared with eSPI (eSPI overlay on request)
LID Signal
Supported
Sleep Signal
Supported
SM Bus
supported
Fast I2C
Connected to module EEPROM, carrier EEPROM and RTC clock
Watchdog Support
Dual staged
RTC
Internal RTC (with external RTC on request)
Display (DDI)
Up to 4k resolutions
Special Kontron Features
Temperature Grade
Industrial grade temperature
Embedded API
KEAPI 3.0 ( included in reference image)
Optional Features
eMMC Flash
Up to 64 GByte pSLC and up to 128 GByte MLC
eDP instead of LVDS
LVDS signals can be overlaid with eDP signals
eSPI instead of LPC
eSPI instead of LPC on the COM connector
UART
2x RX/TX
USB Client
1x USB Client
TPM 2.0
Dedicated TPM chip