- 6 -
2
、
function description
NO.
NAME
FUNCTION
USE METHOD
1
Y-axis adjust
handle
Adjust the top heater
right and left
/
2
Z-axis adjust
handle
Adjust the top heater up
and down
/
3
Heating group
Heating the BGA from
top
Adjust by Z-axis
handle
4
nozzle
Focus on the BGA
surface
/
5
Lower
thermometer
Feedback the true
information
/
6
PCB splint
Support the PCB board
/
7
Lower heating
plate
Heating the BGA from
bottom
/
8
Lower heat
box
Assembly, protect the
heating plate
/
9
nameplate
Information identifying
the machine
/
10 Power switch Control power on and off
/
11
Cooling
system
Cool the PCB board
after heating
Auto activated after
heating
12 PCB supporter
Stop the PCB board from
distorting
Adjust the height of
the screw
13 PLC
Control the top
temperature
According to the
manual