SBC-C23
SBC-C23 User Manual - Rev. First Edition: 1.0 - Last Edition: 1.1 - Author: S.B. - Reviewed by L.B. -Copyright © 2020 SECO S.p.A.
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4.1
Thermal Design
Highly integrated systems, like the SBC-C23 board, offer the user excellent performance in a much reduced space, therefore allowing the system
’
s minimization. On
the other hand, the miniaturizing of IC
’
s and the increase of clock frequencies of the processors lead to the generation of a big amount of heat that must be dissipated
to prevent critical operating conditions, system hang-off or failures.
It is extremely important to note that, for this reason, a critical design parameter always to be kept in very high consideration is the thermal design and analysis of the
final assembled system. It is necessary to carefully consider the heat generated by the module in the final assembled system and the application.
The customer must always ensure that the heatspreader/heatsink surface temperature remain within the declared operating tempe rature range at any point
of the cooling element.
Please always keep in mind that heavy computational tasks will generate much heat, on all versions of the processor.
Therefore, it is always necessary that the customer studies and develops a specifically tailored cooling solution for the final system by evaluating processor
’
s workload,
application environment, system enclosure, air flow and so on.
